Coater Developer Module Quantity and Robot Speed Optimization
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Solution Overview
Problem
Current coater and developer systems in large-scale integrated circuit production lines face challenges in achieving high throughput due to inconsistencies in the quantity of processing modules and wafer transfer speed, leading to inefficiencies and resource wastage.
Innovation Solution
A method is developed to set the quantity of processing modules and the transfer speed of robots in the coater and developer by determining processing time parameters, ensuring consistency among these parameters to optimize throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the quantity of processing modules and robot speed are increased to achieve high throughput, then productivity improves, but device complexity and resource allocation inefficiency worsen
Solution Approach 1:
The patent applies parameter changes by establishing mathematical relationships between throughput, processing time parameters, and robot transfer periodic time parameters. By calculating optimal values for these parameters based on target throughput requirements, the system determines the precise quantity of processing modules and robot speeds needed, avoiding both over-provisioning and under-provisioning of resources.
Solution Approach 2:
The patent implements dynamics by making the system adaptable to different throughput requirements. The method allows dynamic calculation and adjustment of module quantities and robot speeds based on varying production demands, enabling the system to optimize its configuration for different operational scenarios rather than being fixed.
2Productivity
If the quantity of processing modules and robot speed are increased to achieve high throughput, then productivity improves, but resource waste increases
Solution Approach 1:
The patent uses parameter changes to precisely match resource allocation with actual throughput requirements. By calculating optimal processing time parameters and robot transfer periodic time parameters, the system determines the exact number of modules and robot speeds needed, eliminating both over-provisioning (waste) and under-provisioning (insufficient throughput).
3Productivity
If the quantity of processing modules and robot speed are increased to achieve high throughput, then productivity improves, but design and development time increases
Solution Approach 1:
The patent applies preliminary action by performing calculations of optimal module quantities and robot speeds during the design phase based on target throughput requirements. This advance planning and parameter determination eliminates the need for trial-and-error adjustments during manufacturing and operation, significantly reducing the overall development cycle.
Solution Approach 2:
The patent uses parameter changes to establish mathematical models that directly calculate optimal configurations from throughput targets. This approach replaces iterative trial-and-error design methods with direct calculation, enabling rapid determination of system parameters and大幅 shortening the design and development process.
Data Source
AI summary
The present invention relates to developing and design a coater & developer with high throughput that in-line with lithograph equipment during integrated circuit production, which needs to reasonably set the quantity of processing modules and the transfer speed of robots in the coater & developer. The present invention provides a method for setting the quantity of the processing modules and the transfer speed of the robots in the coater & developer, including steps of determining the processing time parameter of the coater & developer according to the target throughput, and designing the processing periodic time parameter of each processing module and the transfer periodic time parameter of each wafer transfer robot in the coater & developer make the three time parameters tend to consistency.