High-Throughput Coating Apparatus for Electronic Device Assemblies

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Solution Overview

Problem

Existing methods for protecting electronic devices from moisture are inefficient in providing high-throughput, moisture-resistant coatings on electronic device assemblies during assembly, often requiring significant space and complex setups that can disrupt assembly lines.

Innovation Solution

A high-throughput coating apparatus that applies protective coatings, such as poly(p-xylylene) using a vaporization and pyrolysis process, to multiple electronic device assemblies simultaneously, with a track system for efficient substrate transport and controlled pressure systems to ensure uniform coating, minimizing space and maintaining assembly line efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If existing methods are used to protect electronic devices from moisture, then moisture resistance is achieved, but throughput is low and assembly line efficiency is reduced

Engineering Contradiction:
ImprovethroughputVSAvoidmoisture resistance
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The coating apparatus is divided into multiple independent coating heads that can simultaneously coat multiple substrates. Each coating head operates independently, allowing parallel processing of multiple electronic device assemblies, thereby increasing throughput while maintaining reliable moisture protection on each substrate.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Multiple coating functions are merged into a single integrated apparatus that can handle multiple substrates simultaneously. The system combines multiple coating heads, transport mechanisms, and control systems into one unified device that processes hundreds of substrates per hour, achieving both high productivity and reliable protection.

Inventive Principle:
Principle #5Merging (Combining)

2Manufacturing precision

If complex coating setups are used to ensure uniform coating, then coating quality is improved, but device complexity and space requirements increase

Engineering Contradiction:
Improvecoating uniformityVSAvoidapparatus complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The coating heads are designed to automatically adjust and maintain optimal coating parameters through self-regulating mechanisms. The system includes automatic substrate positioning, self-adjusting coating head heights, and automated coating parameter control, eliminating the need for complex manual adjustment mechanisms while ensuring uniform coating across all substrates.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The coating apparatus is designed as a universal system that can coat various types of electronic device substrates using the same basic mechanism. The modular coating heads can be adjusted to accommodate different substrate sizes and shapes, reducing the need for multiple specialized coating devices while maintaining coating uniformity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Ease of manufacture

If traditional coating apparatuses are used, then coating application is achieved, but assembly line movement is obstructed and integration is difficult

Engineering Contradiction:
Improveassembly line integrationVSAvoidcoating application efficiency
Core Design Contradiction:
Ease of manufactureVSProductivity

Solution Approach 1:

The coating apparatus incorporates dynamic, movable components including adjustable coating head positions, movable substrate support structures, and flexible transport mechanisms. These dynamic elements allow the apparatus to adapt to different production volumes and substrate types while maintaining a compact footprint that fits within assembly line constraints, and the modular design enables easy integration into existing assembly lines.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables rapid and uniform application of moisture-resistant coatings to hundreds or thousands of electronic device assemblies, ensuring protection against moisture and other substances while integrating seamlessly into assembly lines without obstructing movement.

Implementation Method 1

A high-throughput coating apparatus that applies protective coatings, such as poly(p-xylylene) using a vaporization and pyrolysis process

Methodology Applied
Scientific EffectVaporization: Evaporation

Implementation Method 2

A high-throughput coating apparatus that applies protective coatings, such as poly(p-xylylene) using a vaporization and pyrolysis process

Methodology Applied
Scientific EffectPyrolysis: Pyrolysis

Implementation Method 3

A high-throughput coating apparatus that applies protective coatings, such as poly(p-xylylene) using a vaporization and pyrolysis process

Methodology Applied
Scientific EffectPhysical Vapour Deposition: Physical Vapour Deposition

Data Source

PatentUS11060183B2Apparatuses, systems and methods for applying protective coatings to electronic device assemblies
Publication Date: 2021.07.13 HZO INC
  • US11060183B2 patent drawing

AI summary

A coating apparatus may be configured to concurrently receive and waterproof a large number of electronic device assemblies. The coating apparatus may include a track for transporting the electronic device assemblies into an application station. The application station may have a cubic shape, and include an entry door and an opposite exit door. The entry and exit doors may enable the introduction of substrates into the application station, as well as their removal from the application station. In addition, the entry and exit doors may enable isolation of the application station from an exterior environment and, thus, provide control over the conditions under which a moisture resistant material is applied to the substrates. Methods for making electronic devices and other substrates resistant to moisture are also disclosed.