Electronic Component Coating Carrier for Spill-Free Precision Dipping
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Solution Overview
Problem
Existing coating technologies for electronic components, such as electrostatic, fluid bed, spray gun, and dip coating, result in high material wastage, accumulation of foreign materials, and yield loss due to inaccuracy and miniaturization requirements.
Innovation Solution
A spill-free coating method using a coating carrier with a main base, a coating base with a recess, and a moveable reservoir with a further recess, where the reservoir is slid to transfer coating material into the recess of the coating base, allowing electronic components to be dipped into the coating material without spills or splashes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional coating technologies (electrostatic, fluid bed, spray gun, dip coating) are used, then coating protection is achieved, but material wastage is high
Solution Approach 1:
The coating system is segmented into separate functional components: a reservoir for coating material, a coating carrier with coating head, and a dip well. This segmentation allows precise control of coating material flow and application, reducing wastage while maintaining protection quality.
Solution Approach 2:
The coating material is prepared and contained in the reservoir beforehand, with the coating carrier pre-configured with the dip well. This preliminary preparation ensures that coating material is only released when needed and in controlled amounts, minimizing material wastage while ensuring reliable coating protection.
2Reliability
If conventional coating technologies are used, then coating is applied, but foreign material accumulation occurs
Solution Approach 1:
The harmful aspect of foreign material accumulation is extracted and eliminated by using a closed reservoir system that contains coating material until application. The coating carrier transfers material in a controlled manner, preventing contamination from the environment and eliminating foreign material accumulation while maintaining reliable coating application.
3Reliability
If conventional coating technologies are used, then coating protection is provided, but manufacturing precision is reduced due to miniaturization requirements
Solution Approach 1:
The coating carrier is designed with specific local features including a dip well of controlled dimensions and a coating head with precise geometry. These localized structural qualities ensure that even miniaturized components receive coatings with accurate dimensional control, maintaining manufacturing precision while providing reliable coating protection.
4Productivity
If conventional coating technologies are used, then coating is applied, but additional machine features are required
Solution Approach 1:
Multiple functions are merged into the coating carrier: it serves as both the application tool and the containment structure (with integrated dip well). The reservoir integrates storage and controlled dispensing functions. This merging maintains productivity by eliminating the need for separate recycling, dosing, and leveling machines, while reducing overall device complexity.
5Productivity
If coating material is transferred using conventional methods, then coating is applied, but spills and splashes occur
Solution Approach 1:
The coating carrier acts as an intermediary between the reservoir and the component being coated. It receives coating material in a controlled manner from the reservoir and transfers it to the component via the dip well, preventing spills and splashes during transfer while maintaining productive coating application.
Data Source
AI summary
A method for applying a coating to at least one electronic component. The method includes providing a coating carrier having a main base, a coating base having a recess, and a moveable reservoir having a further recess. The method further includes filling a coating material into the recess of the reservoir; sliding the reservoir along a longitudinal axis of the coating carrier such that the recess of the coating base is filled with coating material; providing an electronic component and dipping at least parts of the electronic component into the coating material provided in the recess of the coating base to form a coating of the electronic component. Furthermore, a sensor arrangement for measuring a temperature is described having a coating applied by the method. A coating carrier for applying a coating to an electronic component is described.


