Coating Developing Apparatus Post-Exposure Delay Time Control
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Solution Overview
Problem
In semiconductor manufacturing, the post-exposure delay time from light exposure to post-exposure baking in photolithography processes is inconsistent due to variations in transfer arm operations, leading to poor line width uniformity and requiring additional post-exposure baking units during immersion light exposure, which increases costs.
Innovation Solution
A coating/developing apparatus with a control section that sets substrates on standby at relay and waiting positions within post-exposure baking units, using a dual transfer mechanism to manage the post-exposure delay time, ensuring consistency without increasing the number of post-exposure baking units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a transfer arm is used for substrate transfer between light exposure apparatus and post-exposure baking unit, then substrate transfer is enabled, but the post-exposure delay time becomes inconsistent
Solution Approach 1:
The transfer system is segmented into two independent transfer mechanisms: a first transfer mechanism for transferring substrates between the process section and light exposure apparatus, and a second transfer mechanism for transferring substrates within the interface section. This segmentation allows independent optimization of each transfer path, enabling consistent post-exposure delay time while maintaining transfer capability.
Solution Approach 2:
A relay position is introduced as an intermediary between the first and second transfer mechanisms. The relay position serves as a buffer that decouples the transfer operations, allowing the system to maintain consistent timing by providing a stable intermediate holding point for substrates during the transfer process.
2Manufacturing precision
If waiting time is extended to make post-exposure delay time constant, then line width uniformity is improved, but throughput decreases
Solution Approach 1:
The system dynamically adjusts the waiting time at the relay position based on the actual transfer time. By making the waiting time variable rather than fixed, the system can compensate for transfer time variations without requiring excessive waiting time, thus maintaining line width uniformity while minimizing throughput impact.
Solution Approach 2:
The control section monitors the actual transfer time and uses this feedback to adjust the waiting time at the relay position. This closed-loop control ensures that the post-exposure delay time remains constant despite variations in transfer operations, achieving line width uniformity without excessive waiting time that would reduce throughput.
3Manufacturing precision
If additional post-exposure baking units are added to handle immersion light exposure, then post-exposure delay time consistency is achieved, but apparatus complexity and cost increase
Solution Approach 1:
The relay position is designed to serve multiple functions: it acts as a transfer point between mechanisms, a waiting position for timing control, and a buffer for decoupling operations. This multi-functionality allows the system to achieve consistent post-exposure delay time without requiring additional dedicated post-exposure baking units, reducing apparatus complexity and cost.
4Productivity
If transfer operations are optimized for speed, then throughput is improved, but post-exposure delay time consistency deteriorates
Solution Approach 1:
The system performs preliminary actions by having substrates wait at the relay position before entering the post-exposure baking unit. This preliminary waiting period allows the system to synchronize transfer operations with the required post-exposure delay time, ensuring consistency even when transfer operations are optimized for speed.
Data Source
AI summary
In a coating/developing apparatus, a process section includes post-exposure baking units each having a waiting position and configured to perform a baking process on a substrate. An interface section transfer mechanism includes a first transfer mechanism configured to transfer the substrate to and from the process section and to load the substrate into the post-exposure baking units, and a second transfer mechanism configured to transfer the substrate to and from the light exposure apparatus. An interface section includes a relay position configured to place thereon the substrate transferred by the second transfer mechanism, and to allow the first transfer mechanism to receive the substrate therefrom. A control section is arranged to set the substrate on standby at the relay position and the waiting position, to make a time period constant among substrates from an end of the light exposure process to a start of a post-exposure baking process.


