Coating Developing Apparatus Mist Film Uniformity
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Solution Overview
Problem
Conventional coating and developing processes for semiconductor wafers are inefficient in forming a uniform liquid film on high water-repellent resist surfaces, leading to increased processing time and costs, and existing solutions do not adequately address the need for high throughput due to the requirement for separate mechanisms for developing and cleaning, which hinder simultaneous processing.
Innovation Solution
A coating and developing apparatus with airtightly sealed processing vessels that use atmosphere gas containing mist or vapor of the developing solution to form a uniform liquid film on the substrate, combined with a transfer mechanism to facilitate simultaneous processing in developing and cleaning modules, allowing for efficient temperature control and condensation of the developing solution onto the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a great amount of developing solution is supplied to form a uniform liquid film on the wafer surface, then the uniformity of the liquid film is improved, but the processing time increases significantly
Solution Approach 1:
The patent applies pneumatic principles by using a nozzle to supply developing solution as a mist or spray under pressure, rather than as a bulk liquid. This pneumatic delivery method allows the developing solution to disperse uniformly across the wafer surface as fine droplets, achieving uniform liquid film formation with significantly reduced solution quantity and processing time compared to conventional bulk liquid supply methods
Solution Approach 2:
The patent changes the physical state and delivery parameters of the developing solution from bulk liquid to mist/spray form. By controlling the nozzle pressure, flow rate, and atomization parameters, the system achieves uniform distribution of the developing solution across the wafer surface, resolving the contradiction between film uniformity and processing time
2Reliability
If high water-repellent resist is used to suppress liquid influence during exposure, then the resist performance is improved, but the wetting uniformity with developing solution deteriorates
Solution Approach 1:
The pneumatic spray system delivers the developing solution as fine mist droplets that can better penetrate and wet the high water-repellent resist surface compared to bulk liquid. The high surface area to volume ratio of the mist droplets enhances contact with the resist, improving wetting uniformity while maintaining the benefits of water-repellent resist
Solution Approach 2:
The system uses dynamic spray parameters including variable pressure, flow rate, and nozzle positioning to adapt the developing solution delivery to the specific wetting requirements of high water-repellent resist, achieving uniform wetting while preserving resist performance
3Reliability
If separate mechanisms for developing and cleaning are used, then the functional reliability is improved, but the device complexity and throughput deteriorate
Solution Approach 1:
The patent merges the developing and cleaning mechanisms into a single integrated apparatus. The same nozzle system that supplies developing solution can be configured to supply cleaning solution, and the airtight processing vessel serves both developing and cleaning operations. This integration maintains functional reliability through dedicated process chambers while eliminating the need for separate mechanisms, thereby improving throughput
Solution Approach 2:
The nozzle system and processing vessel are designed with multi-functionality, capable of performing both developing and cleaning operations. The system can switch between delivering developing solution and cleaning solution using the same hardware infrastructure, reducing device complexity while maintaining process reliability and enhancing productivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables high uniformity and high throughput in forming a liquid film on semiconductor wafers, reducing processing time and costs by allowing simultaneous developing and cleaning processes without the need for separate mechanisms, thereby improving overall efficiency.
Implementation Method 1
a temperature control plate that is provided in the processing vessel and mounts thereon the substrate and cools the substrate
Implementation Method 2
an atmosphere gas supply unit configured to supply an atmosphere gas including mist of a developing solution to a surface of the substrate within the processing vessel
Data Source
AI summary
A coating and developing apparatus develops a substrate of which surface is coated with resist and exposed to lights. The coating and developing apparatus includes a developing module; a cleaning module; and a transfer mechanism configured to transfer a substrate developed by the developing module to the cleaning module. The developing module includes an airtightly sealed processing vessel configured to form a processing atmosphere; a temperature control plate provided in the processing vessel and mounts thereon the substrate and cools the substrate; and an atmosphere gas supply unit configured to supply an atmosphere gas including mist of a developing solution to a surface of the substrate within the processing vessel. The cleaning module includes a mounting table configured to mount thereon the substrate; and a cleaning solution supply unit configured to supply a cleaning solution to the substrate mounted on the mounting table.