Two-Layer Coating for Heat Dissipation in Thin Electronics
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Solution Overview
Problem
Existing cooling methods for heat-producing electronic devices, such as smartphones and tablets, face challenges in efficiently dissipating heat due to their thin, lightweight structures, which makes it difficult to incorporate fans and heat sinks, leading to temperature elevation issues and increased size and cost.
Innovation Solution
A two-layer cooling structure is applied, comprising a heat conduction layer with a first resin and filler, providing high heat conductivity, and a heat radiation layer with a second resin and filler, offering high infrared emissivity, allowing efficient heat transfer and radiation without the need for fans or heat sinks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a fan and heat sink are used for cooling, then heat dissipation is improved, but device size and weight increase
Solution Approach 1:
The patent extracts the cooling function from traditional mechanical components (fan and heat sink) and integrates it into a coating layer applied directly on the device surface. The cooling coating contains heat-conductive particles and infrared radiation-promoting particles that work together to dissipate heat without requiring separate cooling components, thereby eliminating the weight penalty of traditional cooling systems.
Solution Approach 2:
The patent combines multiple cooling mechanisms (heat conduction through particles and infrared radiation) into a single integrated coating layer. This merging of functions allows the coating to perform both heat transfer and heat radiation simultaneously, replacing the need for separate fan and heat sink components while maintaining effective heat dissipation.
2Temperature
If a fan and heat sink are used for cooling, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The patent extracts the cooling function from complex mechanical systems (fan and heat sink) and implements it through a simple coating layer applied on the device surface. This coating contains heat-conductive particles and infrared radiation-promoting particles that work together to dissipate heat without requiring separate cooling components, thereby eliminating the complexity of traditional cooling systems.
Solution Approach 2:
The patent replaces the mechanical cooling system (fan and heat sink) with a chemical/physical coating solution. The cooling coating uses heat-conductive particles for thermal conduction and infrared radiation-promoting particles for radiative cooling, substituting mechanical moving parts with a passive material-based system that achieves the same cooling effect with much lower complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces temperature elevation by transmitting heat to a high heat-conductive resin layer and converting it into infrared radiation, suppressing temperature increases while maintaining mechanical strength and adhesion, thus enabling downsizing and cost reduction in electronic devices.
Implementation Method 1
heat from a heat-producing object is efficiently transmitted to a resin layer including a high heat-conductive filler
Implementation Method 2
the heat is further efficiently converted to infrared rays through the resin layer, which is the surface layer, including a filler having a high infrared emissivity, thereby radiating the infrared rays to the air
Data Source
AI summary
A cooling structure can efficiently reduce heat, thereby suppressing temperature elevation in heat-producing electronic apparatuses, without using a heat sink or water-cooling jacket, and which can achieve their downsizing or weight reduction. The cooling structure includes: a heat conduction layer which is formed by coating a first paste on a surface of a heat-producing object; and a heat radiation layer which is formed by coating a second paste on a surface of the heat conduction layer. The heat conduction layer includes a first resin and a first filler, and a heat conductivity λ of the heat conduction layer is 1.0 W/(m·K) or more. The heat radiation layer includes a second resin and a second filler, and an infrared emissivity ε of the heat radiation layer is 0.7 or more.