Coax-Like Chip Interconnect Layout for RF Crosstalk Isolation

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Solution Overview

Problem

Radio-based communication devices, such as MIMO systems, face issues with undesired crosstalk due to electromagnetic interferences between adjacent communication channels, leading to poor RF isolation and increased electromagnetic interference.

Innovation Solution

The implementation of coax-like electrical connections, comprising a semiconductor chip with an electrical contact and an external connection element providing a vertical connection, and an electrical redistribution layer offering a parallel connection, effectively confines electromagnetic fields and reduces interference by using conductive structures that mimic a coaxial cable configuration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If conventional electrical connections are used between communication channels, then device complexity is reduced, but electromagnetic interference and crosstalk increase between adjacent channels

Engineering Contradiction:

Improveelectromagnetic interferenceVSAvoidconnection structure complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent applies the copying principle by replicating the coaxial cable configuration at the electrical connection level. The electrical redistribution layer creates multiple coax-like connections that mimic the geometry and electromagnetic characteristics of traditional coaxial cables, thereby replicating their superior RF isolation properties in a planar integrated circuit context.

Inventive Principle:

Principle #26Copying

Solution Approach 2:

The patent transitions from three-dimensional coaxial cable structures to two-dimensional planar representations by forming coax-like connections in the electrical redistribution layer. This dimensional transformation allows the system to achieve coaxial-like electromagnetic field confinement and isolation using flat, layered conductive structures suitable for integrated circuit manufacturing.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Object-affected harmful factors

If coax-like electrical connections are implemented, then RF isolation between channels improves, but manufacturing precision requirements increase

Engineering Contradiction:

ImprovecrosstalkVSAvoidelectrical connection precision

Core Design Contradiction:

Object-affected harmful factorsVSManufacturing precision

Solution Approach 1:

The patent employs parameter changes by carefully controlling the geometric dimensions of the conductive structures in the electrical redistribution layer. By optimizing parameters such as conductor width, spacing, and layer thickness, the design achieves coax-like electromagnetic characteristics while maintaining compatibility with standard manufacturing tolerances for electrical connections.

Inventive Principle:

Principle #35Parameter changes

3Object-generated harmful factors

If coax-like electrical connections are used, then electromagnetic field confinement improves, but device complexity increases

Engineering Contradiction:

Improveelectromagnetic interferenceVSAvoidelectrical connection structure

Core Design Contradiction:

Object-generated harmful factorsVSDevice complexity

Solution Approach 1:

The patent merges the functions of multiple electrical connections into a single integrated electrical redistribution layer. By combining signal paths, ground returns, and shielding structures into one monolithic layer formed through standard semiconductor processing, the design achieves coax-like electromagnetic isolation without the mechanical assembly complexity of traditional coaxial connectors.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances RF isolation between channels, reduces electromagnetic interference, and minimizes crosstalk, resulting in improved performance and reduced dispersion, particularly beneficial for high-frequency applications like mmWave frequencies.

Implementation Method 1

effectively confines electromagnetic fields and reduces interference by using conductive structures that mimic a coaxial cable configuration

Methodology Applied

Scientific EffectElectromagnetic field confinement:

Data Source

PatentUS11837565B2Devices including coax-like electrical connections and methods for manufacturing thereof

Publication Date: 2023.12.05 INFINEON TECHNOLOGIES AG

AI summary

A device includes a semiconductor chip including an electrical contact arranged on a main surface of the semiconductor chip. The device includes an external connection element configured to provide a first coax-like electrical connection between the device and a printed circuit board, wherein the first coax-like electrical connection includes a section extending in a direction vertical to the main surface of the semiconductor chip. The device further includes an electrical redistribution layer arranged over the main surface of the semiconductor chip and configured to provide a second coax-like electrical connection between the electrical contact of the semiconductor chip and the external connection element, wherein the second coax-like electrical connection includes a section extending in a direction parallel to the main surface of the semiconductor chip.