Display Panel Conductive Through-Hole Structure for Narrow Bezels
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Solution Overview
Problem
Current display panel designs face challenges in reducing bezel width due to the need for bending the base substrate, which can lead to increased thickness and technical difficulties in drilling deep holes for connecting control ICs, resulting in potential damage and manufacturing complexities.
Innovation Solution
A display panel design featuring a conductive structure between the display structure and the base substrate, with through holes in both structures for electrical connection, eliminating the need for substrate bending and simplifying the manufacturing process by using coaxial holes and shared patterning processes for cost reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the base substrate is bent to connect control lines to the back control IC, then the bezel width is reduced, but the panel thickness increases and manufacturing complexity increases
Solution Approach 1:
The patent divides the connection path into multiple segments: control lines on the front surface connect to through-holes, which penetrate the base substrate to reach contact pads on the back surface. This segmentation eliminates the need for substrate bending while maintaining compact bezel dimensions.
Solution Approach 2:
The patent transitions from a planar connection approach (bending the substrate) to a three-dimensional approach by drilling through-holes perpendicular to the substrate surface. This vertical connection path allows direct electrical connection between front and back surfaces without increasing panel thickness.
2Reliability
If deep holes are drilled through the base substrate for control IC connection, then electrical connection is achieved, but manufacturing difficulty increases and panel reliability decreases
Solution Approach 1:
The patent forms through-holes and contact pads on the back surface before mounting the control IC. This preliminary preparation ensures precise alignment and reduces manufacturing complexity, as the IC can be directly bonded to pre-formed contact pads without requiring post-mounting hole drilling.
3Productivity
If the conductive structure and perforated light-shielding layer are formed in separate processes, then manufacturing flexibility is maintained, but manufacturing time and cost increase
Solution Approach 1:
The patent combines the formation of the conductive structure and the perforated light-shielding layer into a single patterning process. By using a multi-layer structure where the light-shielding layer is formed on the conductive structure, both components are created simultaneously, reducing manufacturing steps and costs.
Data Source
AI summary
A display panel, a display apparatus, and a manufacturing method are disclosed. The display panel includes a base substrate having a first through hole; a conductive structure located on the base substrate and at least partially covering the first through hole; and a display structure including a first display structure, a control line, and a second display structure that are arranged in layers on a side of the base substrate where the conductive structure is located, wherein the first display structure has a second through hole, and the control line is electrically connected to the conductive structure by passing through the second through hole.