Coaxial Bonding Optics for Thermal-Stable Component Positioning
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In ultra-high accuracy positioning applications, slight thermal expansion of components in the optical system can cause deviations in the optical path, breaking the coaxiality of the optical paths for chip and substrate recognition, leading to a deterioration in positioning accuracy.
Innovation Solution
A positioning equipment that includes a camera, a lens, an optical element for synthesizing light from both the bonding head and the stage, and arithmetic equipment to calculate position correction amounts based on camera images, thereby maintaining accurate positioning despite thermal expansions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If separate optical systems are used for chip recognition and substrate recognition, then coaxial imaging can be achieved, but thermal expansion causes optical path deviation and breaks coaxiality
Solution Approach 1:
The patent combines the chip recognition optical system and substrate recognition optical system into a single integrated optical system. This merging eliminates the separate optical paths that were susceptible to thermal expansion deviations, ensuring that both imaging functions share the same optical path and remain coaxial even under thermal conditions.
Solution Approach 2:
The patent designs a single optical system that performs multiple functions: both chip recognition and substrate recognition are achieved through the same optical path. This multi-functional design ensures that thermal expansion affects both imaging paths equally, maintaining their coaxiality while reducing the number of components susceptible to differential thermal expansion.
2Adaptability or versatility
If multiple components are used in the optical system, then imaging functions are achieved, but thermal expansion of components causes optical path deviation
Solution Approach 1:
The patent merges the chip recognition and substrate recognition optical paths into a single integrated optical system. This reduces the total number of optical components from multiple separate systems to one unified system, thereby minimizing the cumulative thermal expansion effects while maintaining full imaging capabilities for both chip and substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents accuracy decreases in positioning by compensating for thermal expansions and maintaining the coaxiality of optical paths, ensuring high precision in mounting components.
Implementation Method 1
an optical element... synthesizes light incident from the bonding head side and light incident from the stage side, and reflects the synthesized light to the lens side
Data Source
AI summary
A positioning equipment includes a camera, a lens disposed in an imaging direction of the camera, a light synthesis unit, and an arithmetic equipment. The light synthesis unit is disposed between a bonding head and a stage when a first component and a second component are positioned, synthesizes light incident from the bonding head side and light incident from the stage side, and reflects the synthesized light to the lens side. The camera images a camera image based on light incident via the lens. The arithmetic equipment obtains a position correction amount between the first component and the second component based on the camera image.