Coaxial Cable Outer Conductor Adhesive Bonding

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Solution Overview

Problem

Conventional coaxial cables face challenges in maintaining electrical properties during thinning, as they experience deterioration in attenuation and return loss, and are prone to disarrangement and loosening of the outer conductor during terminal treatment.

Innovation Solution

A coaxial cable design featuring a metal layer bonded to the outer conductor using an adhesive, with a tape material configuration that includes a resin layer, metal layer, and adhesive, ensuring contact between the metal layer and outer conductor, which prevents disarrangement and maintains electrical properties during twisting.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a braided structure is used for the outer conductor, then the high-frequency property is improved, but the cable thickness increases

Engineering Contradiction:
Improvehigh-frequency propertyVSAvoidcable thickness
Core Design Contradiction:
ReliabilityVSLength of stationary object

Solution Approach 1:

The patent changes the structural form of the outer conductor from a traditional braided structure to a horizontal winding structure with adhesive bonding. This parameter change in the conductor arrangement allows achieving similar high-frequency shielding performance while reducing the overall cable diameter, thus resolving the contradiction between reliability and thickness.

Inventive Principle:
Principle #35Parameter changes

2Stability of the object's composition

If an adhesive layer is provided around the dielectric to prevent outer conductor disarrangement, then the outer conductor stability is improved, but the smoothness between dielectric and outer conductor is lost

Engineering Contradiction:
Improveouter conductor stabilityVSAvoidelectrical property
Core Design Contradiction:
Stability of the object's compositionVSReliability

Solution Approach 1:

The patent applies adhesive bonding locally at the interface between the horizontal winding outer conductor and the dielectric, rather than providing a continuous adhesive layer. This local quality approach prevents disarrangement of the outer conductor while minimizing the impact on the smoothness and electrical performance between the dielectric and outer conductor.

Inventive Principle:
Principle #3Local quality

3Length of stationary object

If the coaxial cable is thinned, then the cable size is reduced, but the electrical properties such as attenuation and return loss deteriorate

Engineering Contradiction:
Improvecable thicknessVSAvoidelectrical property
Core Design Contradiction:
Length of stationary objectVSReliability

Solution Approach 1:

The patent employs a composite structure combining the horizontal winding outer conductor with strategic adhesive bonding and a metal foil layer. This composite material approach allows maintaining effective shielding and electrical performance while reducing the overall cable thickness, thus resolving the contradiction between cable thinning and electrical property maintenance.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively prevents disarrangement and floating of the outer conductor, maintains stable electrical properties before and after twisting, and enhances the coaxial cable's high-frequency performance, allowing for thinner designs without significant attenuation or return loss.

Implementation Method 1

a metal layer, inside an outer conductor, being bonded to the outer conductor by means of an adhesive

Methodology Applied
Scientific EffectAdhesive bonding: Adhesive

Data Source

PatentUS11295873B2Coaxial cable
Publication Date: 2022.04.05 NISSEI ELECTRIC CO LTD
  • US11295873B2 patent drawing
  • US11295873B2 patent drawing
  • US11295873B2 patent drawing

AI summary

A coaxial cable according to the present disclosure is characterized by including a metal layer (5), inside an outer conductor (8), being bonded to the outer conductor (8) by means of an adhesive (6) in such a manner that the metal layer (5) is in contact with a part of the outer conductor (8).