Coaxial Cable Shield with Batch Plating for Bend Resistance
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Solution Overview
Problem
Conventional coaxial cables experience rapid attenuation and degradation in shielding effect due to 'suck-out' phenomena, especially when repeatedly bent, leading to noise interference and signal loss in high-frequency bands.
Innovation Solution
A coaxial cable design featuring a shield layer with a lateral winding shielding portion and a batch plating portion using hot dip plating, where metal wires are helically wrapped around the insulator, and the batch plating covers the shielding portion, with exposed inner peripheral areas and a joining portion between adjacent wires, enhancing flexibility and maintaining shielding effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the shield layer is made of plating to suppress suck-out, then rapid attenuation in predetermined frequency band is suppressed, but crack formation and peeling off occur when repeatedly bent, leading to degradation in shielding effect
Solution Approach 1:
The shield layer combines two different materials: a plating material (for suppressing suck-out and maintaining shielding effect) and a flexible material with elongation of 5% or more (for resistance to bending and crack prevention). This composite structure allows each material to contribute its advantageous properties, resolving the contradiction between shielding effectiveness and bend resistance.
Solution Approach 2:
The shield layer is designed with different materials in different regions or layers. The plating is applied to suppress suck-out in specific frequency bands, while the flexible material with high elongation is positioned to handle bending stresses. This local differentiation of material properties allows the shield layer to simultaneously achieve both shielding effectiveness and bend resistance.
2Stability of the object's composition
If the shield layer uses helically wrapped metal wires, then flexibility is improved, but gaps between wires cause suck-out phenomenon and rapid attenuation in high frequency bands
Solution Approach 1:
The shield layer combines helically wrapped metal wires (providing flexibility) with a plating layer or flexible material having high elongation (providing shielding continuity). This composite approach allows the helical structure to maintain flexibility while the plating or flexible material fills gaps and maintains continuous shielding, preventing suck-out phenomenon.
Solution Approach 2:
The invention specifies that the flexible material must have an elongation of 5% or more, which is a quantitative parameter change that ensures sufficient flexibility to accommodate wire movement and bending without causing gaps that would lead to suck-out. This parameter specification resolves the contradiction between maintaining shielding continuity and preserving flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively suppresses rapid attenuation and maintains shielding effectiveness even under bending and torsion, preventing signal loss up to 26 GHz frequency band by blocking gaps between metal wires and improving bonding strength.
Implementation Method 1
a batch plating portion comprising a hot dip plating, which is covering a periphery of the lateral winding shielding portion
Data Source
AI summary
A coaxial cable is composed of a conductor, an insulator around the conductor, a shield layer around the insulator, and a sheath around the shield layer. The shield layer includes a lateral winding shielding portion with metal wires helically wrapped around the insulator, and a batch plating portion covering the lateral winding shielding portion. The shield layer includes a joining portion where adjacent metal wires are joined with each other with the batch plating portion at a gap between the adjacent metal wires, and inner peripheral portions where the metal wires are not being covered with the batch plating portion and plating layers are exposed. The joining portion is provided between adjacent inner peripheral portions. When an elemental analysis is performed in any analysis region having an area of 0.015 mm2 or more and 0.300 mm2 or less in an insulator-side surface of the shield layer which is stripped from the insulator, an area of a chlorine present region where chlorine is present in the analysis region is 5% or less of an area of the analysis region.