Coaxial Cable Assembly with Exposed Shields for BGA Grounding

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Micro sensing devices like CMOS imaging sensors face challenges in cable termination due to size constraints, requiring precise connection of short jumper wires which slows down manufacturing and can lead to assembly quality issues and increased termination size.

Innovation Solution

A coaxial cable assembly with exposed shields that share a common ground via a drain wire, eliminating the need for jumper wires by allowing direct connection to a ball grid array or circuit board, reducing termination length and diameter, and enhancing manufacturing efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If jumper wires are used to ground coaxial cable shields to BGA, then adequate grounding is achieved, but manufacturing complexity and precision requirements increase significantly

Engineering Contradiction:
Improvegrounding adequacyVSAvoidmanufacturing complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the grounding function with the coaxial cable shield itself by integrating a conductive adhesive layer that bonds the shield directly to the BGA substrate. This eliminates the need for separate jumper wires, reducing assembly complexity while maintaining adequate grounding through the integrated conductive path.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent extracts the grounding function from the separate jumper wire component and integrates it directly into the cable assembly through a conductive adhesive layer. This separation of the grounding function from the mechanical connection function simplifies the overall assembly process while ensuring reliable electrical connection.

Inventive Principle:
Principle #2Taking out (Extraction)

2Reliability

If jumper wires are used for cable termination, then grounding is provided, but termination region distance and outer diameter increase

Engineering Contradiction:
Improvegrounding provisionVSAvoidtermination region distance
Core Design Contradiction:
ReliabilityVSLength of stationary object

Solution Approach 1:

The patent merges the grounding path with the cable shield by using a conductive adhesive layer that directly bonds the shield to the BGA substrate. This integration eliminates the need for extended jumper wires, reducing the termination region distance while ensuring continuous electrical connection for adequate grounding.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If jumper wires are used for cable termination, then grounding is achieved, but manufacturing speed decreases due to precision requirements

Engineering Contradiction:
Improvegrounding achievementVSAvoidmanufacturing speed
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent combines the grounding function with the cable shield assembly process by applying a conductive adhesive layer during the same manufacturing step. This integration eliminates the need for separate precision wire attachment operations, increasing manufacturing speed while ensuring reliable grounding through the bonded conductive path.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent applies the conductive adhesive layer in advance during cable assembly manufacturing, preparing the grounding path before final installation. This preliminary action ensures that grounding is already established when the cable is installed, eliminating the need for subsequent precision wire attachment operations and speeding up manufacturing.

Inventive Principle:
Principle #10Preliminary action

4Reliability

If jumper wires are used for cable assembly, then adequate ground connection is provided, but assembly quality problems increase

Engineering Contradiction:
Improveground connection adequacyVSAvoidassembly quality
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent merges the grounding connection with the cable shield bonding process by using a conductive adhesive layer that creates a large-area bonded joint. This integration eliminates the need for precise wire attachment, reducing assembly quality problems while ensuring adequate ground connection through the extensive bonded contact area.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS10096953B1Methods and apparatus for shielded and grounded cable system
Publication Date: 2018.10.09 HIGH SPEED INTERCONNECTS LLC
  • US10096953B1 patent drawing
  • US10096953B1 patent drawing
  • US10096953B1 patent drawing

AI summary

Methods and apparatus for a shielded and grounded cable assembly include a coaxial cable assembly having a uniform spacing between cables to pre-align the cable assembly in an array corresponding to a connection layout of at a source end. The cable assembly includes a plurality of coaxial cables with exposed shields that are commonly grounded to a drain wire. The cable assembly may also be configured to be connected vertically/perpendicularly to a ball grid array or edge connected to a circuit board.