Coaxial Plasma Coil Diameters for Uniform Substrate Processing
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Solution Overview
Problem
Substrate processing apparatuses with coaxially arranged coils face challenges in achieving uniform plasma density, leading to decreased substrate processing uniformity due to overlapping voltage peaks from the coils.
Innovation Solution
A substrate processing apparatus is designed with a first and second coil surrounding the plasma generation space, where the peak of the second voltage distribution does not overlap with the peak of the first voltage distribution, ensuring a non-overlapping voltage peak configuration to enhance plasma uniformity by using coils with different winding diameters and carefully positioning them to prevent arc discharge and improve plasma distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If two coils of the same diameter are arranged coaxially to generate plasma, then plasma generation capability is improved, but plasma density uniformity deteriorates due to overlapping voltage peaks
Solution Approach 1:
The patent applies asymmetry by configuring the two coils with different diameters rather than the same diameter. The first coil has a larger diameter than the second coil, which creates non-overlapping voltage peaks and prevents plasma density bias, thereby achieving uniform plasma distribution across the substrate surface while maintaining effective plasma generation capability
Solution Approach 2:
The patent implements local quality by positioning the coils at different radial locations with different diameters. The first coil (larger diameter) and second coil (smaller diameter) are arranged such that their voltage peaks occur at different radial positions, creating locally optimized plasma generation zones that collectively provide uniform plasma density across the entire substrate surface
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves improved uniformity of plasma density along the substrate surface, extending plasma lifetime and ensuring consistent processing results by preventing electric power leakage and maintaining desired plasma generation.
Implementation Method 1
a first coil provided to surround the plasma generation space and configured to generate a first voltage distribution; and a second coil provided to surround the plasma generation space and configured to generate a second voltage distribution
Data Source
AI summary
There is provided a technique capable of improving a uniformity of a substrate processing on a substrate surface. According to one aspect thereof, there is provided a substrate processing apparatus including: a substrate processing room; a plasma generation room; a gas supplier supplying a gas into the plasma generation room; a first coil surrounding the plasma generation room and to which an electric power is supplied; and a second coil surrounding the plasma generation room and to which an electric power is supplied. An axial direction of the second coil is equal to that of the first coil, a winding diameter of the second coil is different from that of the first coil, and a peak of a voltage distribution generated by supplying the electric power to the second coil does not overlap with a peak of a voltage distribution generated by the first coil.