Coaxial Combiner Cooling Layout for High-Power Solid-State Amplifiers
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Solution Overview
Problem
Existing solid-state amplifiers face challenges in achieving high power density and bandwidth with efficient thermal management, particularly in confined spaces, due to complex thermal resistance and inefficient heat dissipation, especially in spatial combination.
Innovation Solution
A cylindrical coaxial combiner design with an inner conductor, an outer cover, and a cavity for propagation of RF waves; two outer conductors with coaxial connectors; power amplifying electronic circuit boards with solid-state amplifiers closer to the outer edge; a cooling circuit with a heat-transfer fluid path through the cavity and inner conductor, minimizing thermal distance and maximizing heat exchange surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If spatial combination systems are used to combine multiple amplifiers, then power and bandwidth are increased, but thermal management complexity and device volume increase significantly
Solution Approach 1:
The patent combines multiple solid-state amplifiers into a single integrated cylindrical coaxial combiner structure, merging their thermal management systems into one unified cooling circuit that circulates fluid through the central cavity and inner conductor, thereby reducing overall thermal management complexity while maintaining high power output
Solution Approach 2:
The patent employs a nested structure where the inner conductor is positioned within the cavity, which is surrounded by the outer cover, and the cooling circuit is integrated within these nested components. This nested arrangement allows efficient heat extraction from multiple amplifiers through shared thermal paths without increasing external dimensions
2Temperature
If heat pipes are used to connect hot source and cold source, then heat dissipation is improved, but device volume and complexity increase
Solution Approach 1:
The patent extracts the cooling fluid circulation path directly through the inner conductor and cavity space, removing the need for separate heat pipe components. The heat transfer function is achieved by circulating fluid through the existing structural elements rather than adding dedicated heat dissipation components
Solution Approach 2:
The inner conductor serves multiple functions: it acts as a structural component of the coaxial combiner, a thermal conduction path, and a channel for cooling fluid circulation. This multi-functionality eliminates the need for separate heat pipe elements while maintaining effective heat dissipation
3Temperature
If solid-state amplifiers are placed closer to the inner conductor for cooling, then heat transfer efficiency is improved, but RF performance may be affected
Solution Approach 1:
The patent positions solid-state amplifiers at specific locations on the circuit boards where they are closer to the inner conductor for improved heat transfer, while maintaining proper RF signal paths through the outer conductors and cavity structure. Each amplifier location is optimized for both thermal and RF performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves up to three times greater power density dissipation than existing combiners, with improved compactness and efficiency by minimizing thermal resistance and maximizing heat exchange surface, while maintaining optimal performance and mechanical integrity.
Implementation Method 1
a cooling circuit comprising at least one through portion configured to make a heat-transfer fluid circulate, passing through the cavity of the coaxial combiner, the inner conductor, then the cavity of the coaxial combiner, disposed in contact with the rear part of a power amplifying electronic circuit board on which at least one solid-state amplifier is disposed
Implementation Method 2
make a heat-transfer fluid circulate, passing through the cavity of the coaxial combiner, the inner conductor, then the cavity
Data Source
AI summary
A cylindrical coaxial combiner includes an inner conductor of rectangular section; an outer cover of rectangular section; a cavity between the inner conductor and the outer cover; two outer conductors disposed at the ends of the outer cover, provided with a coaxial connector at their outer end; power amplifying electronic circuit boards connected electrically to the inner conductor; at least one solid-state amplifier, per power amplifying electronic circuit board; and a cooling circuit comprising at least one through portion configured to make a heat-transfer fluid circulate, to inside the inner conductor of the coaxial combiner, disposed in contact with the rear part of a power amplifying electronic circuit board on which at least one solid-state amplifier is disposed.