Coaxial Interconnect for Power and Ground Signal Transmission
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Solution Overview
Problem
Conventional integrated devices require separate interconnects for power and ground signals, leading to limitations in signal transmission and increased size when more than four power signal connections are needed, resulting in unacceptable levels of insertion loss and isolation.
Innovation Solution
An integrated device with a coaxial interconnect configuration, where a first interconnect conducts power signals and a second interconnect, acting as a metal plate, provides a grounding signal, both sharing an insulation material and a mold, allowing for simultaneous transmission of power and ground signals through every interconnect.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate interconnects are used for power and ground signals, then signal transmission is achieved, but the device size increases and isolation levels become unacceptable when more than four power signal connections are needed
Solution Approach 1:
The patent combines power and ground interconnects into a single coaxial structure where the inner conductor carries power signals and the outer conductor carries ground signals. This merging allows both signals to be transmitted through one interconnect location, eliminating the need for separate interconnects and reducing device size while maintaining signal transmission quality through the coaxial geometry that provides inherent isolation.
Solution Approach 2:
The patent implements a nested configuration where the inner conductor (power interconnect) is positioned within the outer conductor (ground interconnect), forming a coaxial structure. This nesting allows the power signal to be transmitted through the center while the ground signal surrounds it, enabling both signals to share the same interconnect location while maintaining electrical isolation through the dielectric material between them.
2Productivity
If additional interconnects are added to transmit more power signals, then signal transmission capacity increases, but the device size expands undesirably
Solution Approach 1:
The coaxial interconnect structure serves multiple functions simultaneously: the inner conductor transmits power signals, the outer conductor provides ground signals, and the dielectric material between them provides electrical isolation. This multi-functionality allows a single interconnect location to handle both power and ground connections, increasing signal transmission capacity without requiring additional interconnects that would expand device size.
3Productivity
If power signals are transmitted through every interconnect, then interconnect utilization is maximized, but isolation and insertion loss become unacceptable without proper grounding
Solution Approach 1:
The patent merges the power and ground interconnects into a coaxial structure where the outer conductor serves as a ground shield surrounding the inner power conductor. This configuration allows every interconnect to carry power signals while the surrounding ground conductor provides the necessary isolation, preventing interference and maintaining acceptable insertion loss levels through the inherent shielding effect of the coaxial geometry.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient transmission of both power and ground signals through every interconnect, maintaining acceptable levels of isolation and reducing the size of the integrated device by eliminating the need for additional interconnects.
Implementation Method 1
a second interconnect surrounding the first interconnect and configured to provide an electrical connection to ground
Implementation Method 2
The integrated device may include a dielectric material between the first interconnect and the second interconnect
Data Source
AI summary
Some novel features pertain to an integrated device that includes a substrate, a first interconnect coupled to the substrate, and a second interconnect surrounding the first interconnect. The second interconnect may be configured to provide an electrical connection to ground. In some implementations, the second interconnect includes a plate. In some implementations, the integrated device also includes a dielectric material between the first interconnect and the second interconnect. In some implementations, the integrated device also includes a mold surrounding the second interconnect. In some implementations, the first interconnect is configured to conduct a power signal in a first direction. In some implementations, the second interconnect is configured to conduct a grounding signal in a second direction. In some implementations, the second direction is different from the first direction. In some implementations, the integrated device may be a package-on-package (PoP) device.