Coaxial Interposer Package Layout for RF Signal Loss Reduction
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Solution Overview
Problem
Current chip package structures with integrated antenna structures suffer from signal loss and large volume due to ineffective radio frequency signal containment during transmission, hindering miniaturization and weight reduction of electronic products.
Innovation Solution
An electronic package structure incorporating a circuit board, interposer with a through groove, and a coaxial conductive element comprising a first and second conductive structure separated by an insulating structure, which is integrated with a circuit structure and chip to minimize signal loss and electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a film sealing material is used to cover the chip and antenna structure, then the package structure is formed, but the radio frequency signal spreads during transmission causing signal loss
Solution Approach 1:
A coaxial conductive element is introduced as an intermediary between the chip and the external environment to transmit radio frequency signals. This coaxial structure with its inner conductor, outer conductor, and insulating layer configuration acts as a controlled transmission path that prevents signal spreading and maintains signal integrity through the package structure.
2Ease of operation
If the antenna structure is disposed on the chip package structure with conductive columns penetrating the film sealing material, then electrical connection is achieved, but the package structure has large volume
Solution Approach 1:
The conductive connection structure transitions from a three-dimensional penetrating column through the film sealing material to a more compact planar configuration. The coaxial conductive element is disposed substantially in the same plane as the chip, eliminating the need for vertical penetration through thick sealing materials and thereby reducing overall package volume while maintaining electrical connectivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure effectively reduces signal loss and electromagnetic interference, facilitating miniaturization by optimizing space utilization and enhancing signal integrity.
Implementation Method 1
The coaxial conductive element penetrates the interposer to electrically connect the circuit structure and the circuit board
Implementation Method 2
The first insulating structure is disposed between the first conductive structure and the second conductive structure
Data Source
AI summary
An electronic package structure and manufacturing method thereof. The electronic package structure includes a circuit board, an interposer, a chip, a circuit structure, and a coaxial conductive element. The interposer is disposed on the circuit board. The interposer has a through groove. The chip is disposed in the through groove and located on the circuit board to electrically connect with the circuit board. The circuit structure is disposed on the interposer. The coaxial conductive element penetrates the interposer to electrically connect the circuit structure and the circuit board. The coaxial conductive element includes a first conductive structure, a second conductive structure, and a first insulating structure. The second conductive structure surrounds the first conductive structure. The first insulating structure is disposed between the first conductive structure and the second conductive structure.