Coaxial Interposer Package for RF Loss and EMI Shielding
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Solution Overview
Problem
Existing chip package structures with integrated antenna structures suffer from large volume and significant radio frequency signal loss during transmission, failing to effectively prevent electromagnetic interference.
Innovation Solution
An electronic package structure incorporating an interposer with a coaxial conductive element, a circuit board, and a circuit structure, where the chip is disposed in a cavity of the interposer, utilizing a conductive interposer substrate to reduce signal loss and enhance electromagnetic interference shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a film sealing material covers the chip to form the chip package structure with antenna structure, then the chip is protected and antenna function is integrated, but the volume is relatively large and radio frequency signal loss occurs during transmission
Solution Approach 1:
The patent embeds the coaxial conductive element within the interposer substrate, nesting the transmission line structure inside the package substrate rather than using external traces. This nested configuration reduces the overall package volume while maintaining signal integrity by providing a shielded transmission path for radio frequency signals.
Solution Approach 2:
The patent transitions from planar trace-based signal transmission to three-dimensional coaxial cable architecture by embedding the coaxial conductive element vertically within the interposer substrate. This dimensional change enables compact signal routing that reduces both package volume and signal loss simultaneously.
2Reliability
If a film sealing material covers the chip to form the chip package structure with antenna structure, then the chip is protected and antenna function is integrated, but significant radio frequency signal loss occurs during transmission
Solution Approach 1:
The coaxial conductive element is nested within the interposer substrate, creating a shielded transmission line that protects radio frequency signals from external interference and reduces electromagnetic radiation losses. This nested configuration maintains signal integrity while minimizing energy loss during transmission.
Solution Approach 2:
The interposer substrate acts as an intermediary structure that provides a controlled impedance environment for signal transmission. By embedding the coaxial conductive element within the substrate, the patent creates an intermediate transmission medium that reduces signal loss between the antenna and circuit board connections.
3Adaptability or versatility
If conventional chip package structure with antenna is used, then integration is achieved, but electromagnetic interference cannot be effectively prevented
Solution Approach 1:
The coaxial conductive element is nested within the interposer substrate, creating an inherent shielded transmission line structure. This nested configuration provides electromagnetic shielding that prevents external interference from affecting signal transmission while maintaining the integrated package design.
Solution Approach 2:
The interposer substrate combines dielectric material with embedded coaxial conductive elements to create a composite structure that provides both mechanical support and electromagnetic shielding. This composite architecture effectively blocks electromagnetic interference while maintaining signal transmission quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure achieves miniaturization and improves signal integrity by reducing radio frequency signal loss and shielding electromagnetic interference, while enhancing heat dissipation capabilities.
Implementation Method 1
The coaxial conductive element includes a first conductive structure, a second conductive structure, and a first insulation structure. The second conductive structure surrounds the first conductive structure. The first insulation structure is disposed between the first conductive structure and the second conductive structure.
Implementation Method 2
The interposer includes an interposer substrate and a coaxial conductive element. A material of the interposer substrate includes a conductive material. The circuit board is disposed on the lower surface of the interposer substrate and electrically connected to the coaxial conductive element.
Implementation Method 3
The second conductive structure surrounds the first conductive structure. The first insulation structure is disposed between the first conductive structure and the second conductive structure, reducing signal loss and shielding electromagnetic interference.
Data Source
AI summary
An electronic package structure and its manufacturing method are provided. The electronic package structure includes an interposer, a circuit board, a chip, and a circuit structure. The interposer includes an interposer substrate and a coaxial conductive element located in the interposer substrate. The interposer substrate includes a cavity. The coaxial conductive element includes a first conductive structure, a second conductive structure surrounding the first conductive structure, and a first insulation structure. The first insulation structure is disposed between the first and second conductive structures. The circuit board is disposed on a lower surface of the interposer substrate and electrically connected to the coaxial conductive element. The chip is disposed in the cavity and located on the circuit board, so as to be electrically connected to the circuit board. The circuit structure is disposed on an upper surface of the interposer substrate and electrically connected to the coaxial conductive element.