Coaxial Isolator PCB Layout Without Ring Capacitors
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Solution Overview
Problem
Current coaxial isolators using ring capacitors are expensive, difficult to manufacture, and complex to assemble, while also requiring costly ring capacitors to achieve signal isolation.
Innovation Solution
A coaxial isolator design that eliminates the need for ring capacitors by using an integrated circuit board with capacitors and an iron core, which achieves signal isolation through symmetric capacitor arrangements and good grounding characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ring capacitors are used in signal isolation component, then signal isolation effect is improved, but production cost increases
Solution Approach 1:
The patent replaces expensive ring capacitors with ordinary capacitors and iron cores that can be obtained from standard electronic component suppliers. This substitution dramatically reduces component costs while maintaining the signal isolation function through an alternative electromagnetic shielding mechanism using the iron core.
Solution Approach 2:
The patent replicates the signal isolation effect of ring capacitors using a different configuration - specifically, using ordinary capacitors arranged in a specific pattern with an iron core to achieve the same electromagnetic shielding and signal isolation performance without requiring the complex ring capacitor structure.
2Reliability
If ring capacitors are used in signal isolation component, then signal isolation effect is improved, but assembly complexity increases
Solution Approach 1:
The patent divides the signal isolation function into separate components: ordinary capacitors positioned at specific locations and an iron core placed within the circuit board. This segmentation allows each component to be manufactured and assembled independently using standard processes, eliminating the need for complex ring capacitor assembly.
Solution Approach 2:
The iron core automatically provides magnetic shielding and enhances the isolation effect through its inherent magnetic properties, eliminating the need for additional adjustment or complex assembly procedures. The ordinary capacitors are positioned to naturally achieve the required electrical isolation without requiring precision alignment or special assembly techniques.
3Reliability
If ring capacitors are used in signal isolation component, then impedance matching is improved, but manufacturing difficulty increases
Solution Approach 1:
The patent changes the approach to impedance matching by using the iron core's magnetic permeability to control electromagnetic field distribution, rather than relying on the complex capacitance geometry of ring capacitors. This allows impedance matching to be achieved through material property selection and component positioning rather than complex manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed coaxial isolator reduces production costs, simplifies assembly, and maintains effective signal isolation comparable to ring capacitor-based isolators, while minimizing radio frequency interference (RFI).
Implementation Method 1
The first capacitors are located on the first surface of the substrate and are respectively arranged on both sides of the signal processing circuit. The second capacitors are located on the second surface of the substrate and are respectively correspond to the positions of the first capacitors.
Implementation Method 2
The first iron core surrounds the signal processing circuit and is adjacent to the first capacitors and the second capacitors.
Data Source
AI summary
A coaxial isolator includes an integrated circuit board, a first body and a second body. The integrated circuit board includes a first surface, a second surface, a signal processing circuit extending along a central axis, two first capacitors, two second capacitors, and a first iron core. The first capacitors are located on the first surface and are respectively disposed on both sides of the signal processing circuit. The second capacitors are located on the second surface and are respectively arranged corresponding to the positions of the first capacitors. The first iron core surrounds the signal processing circuit. A first tube portion of the first body surrounds the integrated circuit board, and a first end portion of the first body is used for connecting with an external device. A second end portion of the second body is used for connecting with another external device.