Coaxial Laser Vision Substrate Edge Etching Offset Control
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Solution Overview
Problem
In semiconductor and liquid crystal display manufacturing, the etching process for substrate edges is inefficient due to the need for recalculating the edge region and adjusting the irradiation location of lasers, which increases treatment time and struggles with minute substrate diameter differences.
Innovation Solution
A substrate treating apparatus with a vision unit to measure substrate eccentricity and adjust laser irradiation location using a coaxial laser unit, a support unit for rotation, and an adjustment unit that synchronizes with the spin head to adjust the laser's irradiation based on calculated offset values.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the substrate is rotated and the edge region is calculated by measuring reflected light, then the edge region can be identified, but the treatment time increases due to requiring the substrate to be placed again on the electrostatic chuck
Solution Approach 1:
The patent combines the vision unit and laser unit into a coaxial configuration, allowing both measurement and etching operations to be performed through the same optical path. This eliminates the need to reposition the substrate on a different chuck, thereby reducing treatment time while maintaining measurement precision for edge region identification
Solution Approach 2:
The coaxial arrangement allows the same optical axis to serve dual purposes: first for measuring reflected light to calculate the edge region, and then for laser irradiation to perform etching. This multi-functional use of the optical path reduces the number of操作步骤 and overall process time
2Adaptability or versatility
If the substrate diameter varies slightly, then different substrates need to be processed, but it is difficult to correct the minute differences in diameter
Solution Approach 1:
The vision unit continuously measures the substrate's reflected light to calculate the edge region and provides feedback information about the actual substrate diameter and edge position. This feedback is used to adjust the laser irradiation parameters in real-time, enabling precise etching positioning even when substrate diameters vary slightly
Solution Approach 2:
The system dynamically adjusts the laser irradiation parameters based on real-time measurements of substrate diameter and edge region. By making the etching process adaptive to each substrate's actual dimensions, the system maintains high manufacturing precision across substrates with varying diameters
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces etching process time and improves accuracy by precisely adjusting the laser's irradiation location in real-time, even with minor substrate diameter variations.
Implementation Method 1
the amount of light reflected from the substrate is measured to calculate the edge region of the substrate
Implementation Method 2
the calculated edge region of the substrate is irradiated with laser to perform the etching process
Data Source
AI summary
Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a chamber providing a space in which a substrate is treated, a support unit supporting the substrate inside the chamber, a laser unit irradiating laser to an edge region of the substrate, a vision unit capturing the edge region of the substrate to measure an offset value of the substrate, and an adjustment unit adjusting an irradiation location of the laser based on the offset value of the substrate.