Coaxial LGA Socket for Multi-Die ASIC Signal Integrity
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Solution Overview
Problem
Conventional BGA packages face assembly yield loss, long-term reliability issues, and cannot support high-speed I/O memory and high-power devices due to signal and power integrity concerns, while LGA socket solutions suffer from signal integrity issues like reflection loss and power loss, and cannot support multi-die or package configurations.
Innovation Solution
A microelectronic system with a ground shielded coaxial socket pin design and integrated voltage regulators (IVRs) that includes a land grid array (LGA) socket with a substrate and coaxial socket pins to improve signal and power integrity, allowing easy swapping and supporting multiple dies or packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If BGA packages are used to mount ASICs, then signal and power integrity is improved, but reliability and replaceability deteriorate due to direct solder mounting
Solution Approach 1:
The system separates the ASIC die from the mounting substrate by introducing an intermediate LGA socket. The socket contains multiple contact pads that interface with the ASIC die, while the socket itself is mounted to the substrate, creating a modular architecture that enables replacement without replacing the entire assembly.
Solution Approach 2:
The LGA socket acts as an intermediary component between the ASIC die and the mounting substrate. It provides electrical connections through contact pads while enabling mechanical removal and replacement of the die, thus mediating between the need for reliable electrical connection and the need for replaceability.
2Ease of operation
If conventional LGA socket solutions are used, then replaceability is improved, but signal integrity deteriorates due to impedance discontinuity and crosstalk
Solution Approach 1:
The socket contact pads are designed with specific local geometric characteristics including rounded corners and optimized dimensions. These local quality features are engineered to maintain consistent impedance characteristics and reduce signal reflections at the contact interface, thereby improving signal integrity while preserving replaceability.
3Ease of operation
If conventional LGA socket solutions are used, then replaceability is improved, but power integrity deteriorates due to high pin contact resistance and inductance
Solution Approach 1:
The contact pads extend in multiple dimensions with optimized length, width, and corner radius parameters. This dimensional optimization reduces contact resistance by increasing the effective contact area and improves power delivery by minimizing inductance through geometric tuning of the pad structure.
4Device complexity
If conventional LGA sockets are used, then a one-to-one package/socket connection is achieved, but support for multi-die configurations deteriorates
Solution Approach 1:
The socket is designed with a universal interface that can accommodate multiple different die configurations. The contact pad array and mechanical structure are engineered to support various die sizes, shapes, and pinout configurations, enabling a single socket to serve multiple functions and support multi-die or package arrangements.
Data Source
AI summary
A microelectronic system may include a microelectronic component having electrically conductive elements exposed at a first surface thereof, a socket mounted to a first surface of the microelectronic component and including a substrate embedded therein, one or more microelectronic elements each having active semiconductor devices therein and each having element contacts exposed at a front face thereof, and a plurality of socket pins mounted to and extending above the substrate, the socket pins being ground shielded coaxial socket pins. The one or more microelectronic elements may be disposed at least partially within a recess defined within the socket. The socket may have a land grid array comprising top surfaces of the plurality of the socket pins or electrically conductive pads mounted to corresponding ones of the socket pins, and the element contacts of the one or more microelectronic elements may be pressed into contact with the land grid array.