Coaxial LGA Socket for Replaceable Multi-Die ASICs
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Solution Overview
Problem
Conventional BGA packages face assembly yield loss and reliability issues, and existing LGA socket solutions suffer from signal and power integrity problems, inability to support high-speed I/O and multi-die configurations, and are not easily replaceable.
Innovation Solution
A land grid array (LGA) socket system with ground shielded coaxial socket pins, integrated voltage regulators, and a substrate with redistribution layers, enabling easy swapping and improved signal and power integrity for multi-die configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If BGA packages are used to mount ASICs, then signal and power integrity are improved, but replaceability and repairability deteriorate due to direct mounting with solder
Solution Approach 1:
The system divides the connection into two separate interfaces: a BGA interface for mounting the socket to the circuit board (providing signal and power integrity), and an LGA interface for mounting/dismounting microelectronic elements (providing replaceability). This segmentation allows each interface to optimize for its specific function without compromise.
Solution Approach 2:
The socket acts as an intermediary component between the circuit board and the microelectronic element. It provides BGA connections to the board while offering LGA connections to the element, mediating between the requirements for reliable mounting and easy replaceability.
2Ease of repair
If existing LGA socket solutions are used, then replaceability is improved, but signal integrity and power integrity deteriorate due to impedance discontinuity, crosstalk, and high pin inductance
Solution Approach 1:
The socket pins are designed with specific geometric parameters (coaxial structure with ground shields) to control electrical characteristics such as impedance, inductance, and crosstalk. The pins have a diameter of 0.5mm to 1.5mm and are positioned with precise pitch (0.5mm to 2.0mm) to optimize signal and power integrity while maintaining LGA replaceability.
Solution Approach 2:
The socket provides an intermediate LGA interface that bridges the gap between traditional LGA replaceability and the need for high signal/power integrity. The carefully designed pin structure serves as a mediator that achieves both goals simultaneously.
3Ease of repair
If existing LGA socket solutions are used, then replaceability is improved, but support for high-speed I/O and multi-die configurations deteriorates
Solution Approach 1:
The socket is designed with universal LGA compatibility to support various microelectronic elements including single-die and multi-die configurations. The standardized pin interface and recess design allow the same socket to accommodate different element types and sizes, enabling high-speed I/O support while maintaining replaceability.
Solution Approach 2:
The socket includes a recess that receives microelectronic elements, creating a vertical dimension for element placement. This allows multi-die configurations where multiple elements can be stacked or arranged within the recess area, expanding versatility beyond traditional planar LGA connections.
4Reliability
If conventional BGA packages are used, then signal integrity is improved, but assembly yield loss increases and long-term reliability deteriorates
Solution Approach 1:
The system segments the assembly into three replaceable components: the circuit board, the socket, and the microelectronic element. This allows defective elements to be replaced without replacing the entire assembly, improving assembly yield by enabling selective replacement of only the faulty component.
Solution Approach 2:
The design enables discarding only the defective microelectronic element while recovering and reusing the expensive socket and circuit board. This selective replacement approach improves assembly yield by reducing waste and allowing recovery of valuable components.
Data Source
AI summary
A microelectronic system may include a microelectronic component having electrically conductive elements exposed at a first surface thereof, a socket mounted to a first surface of the microelectronic component and including a substrate embedded therein, one or more microelectronic elements each having active semiconductor devices therein and each having element contacts exposed at a front face thereof, and a plurality of socket pins mounted to and extending above the substrate, the socket pins being ground shielded coaxial socket pins. The one or more microelectronic elements may be disposed at least partially within a recess defined within the socket. The socket may have a land grid array comprising top surfaces of the plurality of the socket pins or electrically conductive pads mounted to corresponding ones of the socket pins, and the element contacts of the one or more microelectronic elements may be pressed into contact with the land grid array.