Coaxial Multi-Laser Focusing for Thick Workpiece Cutting Precision
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Solution Overview
Problem
Laser cutting technology faces challenges when processing workpieces thicker than the laser beam's energy focus area, leading to significant offset of cutting lines and reduced yield due to the gradual decrease in energy density from the midpoint of the focus area.
Innovation Solution
A laser processing device with at least two lasers, focusing members, and a beam combination member that adjusts and outputs the laser beams coaxially to maintain precise cutting, utilizing dynamic or fixed focal length lenses to control focusing positions and improve energy utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the laser beam is used to cut workpieces thicker than the energy focus area, then the cutting depth can be increased, but the cutting line offset increases significantly
Solution Approach 1:
The patent divides the cutting process into multiple passes, with each laser beam responsible for cutting at a specific depth range. The first laser beam cuts the upper portion of the workpiece, while the second laser beam cuts the lower portion. This segmentation allows each beam to operate within its optimal focus range, preventing cumulative offset errors that would occur with sequential single-beam cutting.
Solution Approach 2:
The patent combines multiple laser beams into a single processing system that operates simultaneously. By merging the first and second laser beams into one coherent cutting system with coordinated focusing members, the patent achieves deep cutting without the positioning errors that would result from sequential processing. The beams work together as an integrated system to maintain precision throughout the entire workpiece thickness.
2Productivity
If multiple laser beams are used to cut thick workpieces, then the cutting efficiency can be improved, but the system complexity increases
Solution Approach 1:
The patent employs focusing members with adjustable focal lengths that can adapt to different cutting depths and workpiece configurations. This multi-functionality allows the same optical system to handle various cutting scenarios without requiring separate specialized components for each function, thereby managing complexity while maintaining versatility.
Solution Approach 2:
The patent utilizes focusing members whose focal lengths can be dynamically adjusted based on the specific cutting requirements. By changing the focal length parameter of the focusing members, the system can optimize the laser beam focus for different depth ranges and workpiece types, enabling efficient multi-beam processing without requiring entirely separate optical systems for each configuration.
3Length of stationary object
If the laser energy density decreases from the focus area, then the beam can penetrate deeper, but the cutting precision deteriorates
Solution Approach 1:
The patent assigns different focusing members with optimized focal lengths to different laser beams, creating local optimization for each beam's specific cutting zone. The first focusing member optimizes the first laser beam for upper portion cutting, while the second focusing member optimizes the second laser beam for lower portion cutting. This local quality approach ensures maximum energy density and cutting precision at each specific depth range throughout the workpiece.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances processing precision, reduces energy consumption, minimizes smoke and particle generation, and decreases the thermally-affected area by applying the laser beams simultaneously and accurately, improving cutting efficiency and yield.
Implementation Method 1
focusing members, wherein the focusing members are arranged corresponding to the at least two lasers respectively in a one-to-one manner, and configured to adjust focusing positions of at least two laser beams generated by the at least two lasers
Implementation Method 2
a beam combination member configured to receive the at least two laser beams whose focusing positions have been adjusted, and coaxially output the at least two laser beams
Implementation Method 3
at least two lasers, wherein each of the at least two lasers is configured to generate a laser beam
Data Source
AI summary
A laser processing device and a laser processing method are provided. The laser processing device includes: at least two lasers each configured to generate a laser beam; focusing members corresponding to the at least two lasers respectively and configured to adjust focus positions of at least two laser beams generated by the at least two lasers; and a beam combination member configured to receive the at least two laser beams whose focus positions have been adjusted, and output the at least two laser beams coaxially.