Coaxial PCB Through-Hole Structure for Low-Loss RF Signal Transfer
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Solution Overview
Problem
In wireless communication systems, particularly in 5G networks, there is a challenge in reducing signal transmission loss across printed circuit boards (PCBs) due to the high-frequency signals used, which affects the efficiency of data transmission and reception.
Innovation Solution
The implementation of a coaxial plated through-hole (PTH) structure in printed circuit boards (PCBs) that electrically connects antenna modules and radio frequency integrated circuits (RFICs), providing a low-loss transmission path through multiple layers, utilizing coaxial feedlines and plated regions to minimize signal attenuation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional plated through-holes are used in PCBs for high-frequency signal transmission, then the PCB structure is simple and easy to manufacture, but signal transmission loss increases due to discontinuous ground references and impedance variations
Solution Approach 1:
The patent implements a nested structure where an inner conductive plug is placed inside an outer conductive sleeve within the plated through-hole. This nested arrangement creates a coaxial configuration that provides continuous ground reference and maintains impedance control throughout the signal transmission path, thereby reducing signal loss while adding structural complexity only where needed for performance.
Solution Approach 2:
The patent uses composite conductive structures combining different conductive elements (inner plug, outer sleeve, plated walls) with different geometric configurations. This composite approach allows optimization of electromagnetic field distribution and impedance characteristics, reducing signal transmission loss through controlled field confinement and minimized discontinuities.
2Reliability
If coaxial plated through-holes with inner plugs and outer sleeves are implemented, then signal transmission loss is reduced through continuous ground reference and impedance control, but manufacturing complexity and process difficulty increase
Solution Approach 1:
The patent incorporates the inner conductive plug and outer conductive sleeve as pre-fabricated components that are inserted into the PCB holes before final plating. This preliminary preparation allows precise control of the coaxial geometry and gap dimensions, ensuring consistent impedance and ground reference, while simplifying the overall manufacturing process by separating the complex structural formation from the electrical connection formation.
Solution Approach 2:
The patent optimizes specific geometric parameters of the coaxial structure, including the diameter and position of the inner plug, the dimensions and spacing of the outer sleeve, and the plating thickness. By carefully controlling these parameters, the design achieves reliable impedance control and continuous ground reference, improving signal transmission stability while keeping the structure manufacturable through standard PCB processes.
3Productivity
If traditional via structures are used, then the PCB design is simple and fabrication is straightforward, but signal attenuation increases at high frequencies due to lack of impedance control and ground continuity
Solution Approach 1:
The nested coaxial configuration of inner plug within outer sleeve creates a controlled transmission path that confines electromagnetic fields and maintains consistent impedance. This structure provides continuous ground reference through both the inner and outer conductors, reducing signal attenuation and improving data transmission efficiency at high frequencies, while the added structural complexity is localized to the critical via regions.
Solution Approach 2:
The conductive plating on the via walls acts as an intermediary element that bridges the inner plug and outer sleeve, ensuring continuous electrical connection and ground reference. This intermediary plating layer maintains impedance control and provides a transition path for electromagnetic fields, reducing reflections and signal loss while connecting the different conductive components.
Data Source
AI summary
The disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An electronic apparatus is provided. The electronic apparatus includes a printed circuit board (PCB), an antenna module mounted on a surface of the printed circuit board, and a radio frequency integrated circuit (RFIC) module mounted on another surface of the printed circuit. The printed circuit board includes a coaxial plated through-hole (PTH) electrically connected with the antenna module and the RFIC.