Coaxial to Planar Line Connection via Adhesion Layers
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Solution Overview
Problem
Existing high-frequency line connection structures face challenges in achieving low return loss and low insertion loss characteristics over a wide band due to differences in structural modes between coaxial and planar lines, leading to energy loss and reflection issues, especially at high frequencies like 100 GHz.
Innovation Solution
A high-frequency line connection structure is designed with a coaxial line featuring an inner conductor and outer conductor, an insulation layer, and conductive adhesion layers to connect the coaxial line with a planar line on a dielectric substrate, ensuring proper alignment and electrical continuity through through holes and half through holes, minimizing differences in fundamental modes and reducing radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a dielectric layer is introduced to facilitate mode conversion at the connection section, then the fundamental mode conversion is improved, but high-frequency loss increases
Solution Approach 1:
The patent removes the dielectric layer from the connection section, extracting the source of high-frequency loss while maintaining mode conversion through alternative means (direct metal-to-metal contact and geometric design of the connection structure).
Solution Approach 2:
The patent changes the geometric parameters of the connection structure, specifically designing the inner conductor to protrude by a controlled distance and the outer conductor with a specific opening size, to achieve mode conversion without requiring a dielectric layer.
2Object-affected harmful factors
If a radio wave absorption layer is introduced to absorb unwanted radiation, then radiation absorption is improved, but energy loss increases
Solution Approach 1:
The patent converts the harmful radiation issue into a geometric design problem, using the shape and dimensions of the conductors and their arrangement to inherently minimize radiation, thus eliminating the need for absorption materials that would cause energy loss.
Solution Approach 2:
The patent introduces a conductive adhesive layer as an intermediary substance that provides both mechanical bonding and electrical continuity, while its conductive nature helps contain electromagnetic fields and reduce radiation.
3Reliability
If the inner conductor protrudes from the outer conductor end surface, then mode conversion is facilitated, but return loss increases due to bypass of return current path
Solution Approach 1:
The patent creates a dynamic transition zone where the inner conductor protrudes to enable mode conversion, but the return current path is dynamically guided through the outer conductor's opening and the conductive adhesive layer, adapting the current flow to minimize bypass effects.
Solution Approach 2:
The patent ensures continuous electrical connection and current flow through the conductive adhesive layer that bridges the gap between the inner conductor and the planar line, maintaining continuous action of the return current path and preventing bypass.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration results in a high-frequency line connection structure with low return loss and low insertion loss characteristics over a wide band, enhancing transmission efficiency and minimizing energy loss, suitable for next-generation optical communication components.
Implementation Method 1
a first adhesion layer that is conductive, and that is formed to cover the leading end portion of the inner conductor and an end of the signal line included in the planar line
Implementation Method 2
a second conductive thin film that covers a back surface of the substrate, the second conductive thin film being electrically connected to the pair of first conductive thin films
Data Source
AI summary
A high-frequency line connection structure 1 for connecting a coaxial line and a planar line includes a conductive second adhesion layer that is formed along edges of a pair of first conductive thin films of the planar line. Furthermore, end portions of the pair of first conductive thin films and an end portion of a second conductive thin film that is adjacent to the coaxial line are disposed to coincide with a position of an inner wall of a columnar penetrating hole formed in an outer conductor.