Coaxial Semiconductor Testing Probe for Spherical Terminal Contact
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Solution Overview
Problem
Traditional semiconductor testing probes with double parallel ejector pins or connecting fingers face challenges such as low fabrication precision, weak structural strength, short service lifetime, low measurement resolution, and inability to test spherical terminals due to their design limitations as semiconductor components shrink in size.
Innovation Solution
A testing probe with a coaxial structure comprising a first testing pin, an insulating layer, and a second testing pin surrounding the first, where the second testing pin forms a concave surface to improve mechanical strength and precision, allowing for accurate contact with spherical terminals and enhancing test accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If double parallel ejector pins or connecting fingers are used for testing, then the testing structure is simple, but the fabrication precision is low
Solution Approach 1:
The patent employs a nested structure where the first testing pin is positioned inside the second testing pin, forming a coaxial arrangement. This nesting approach enables precise positioning of multiple testing pins while maintaining a compact overall structure, thereby improving fabrication precision without significantly increasing device complexity.
Solution Approach 2:
The patent transitions from a planar parallel arrangement of testing pins to a three-dimensional coaxial structure. By utilizing the radial dimension and arranging pins concentrically, the design achieves higher positioning precision and better structural stability while keeping the footprint compact.
2Manufacturing precision
If ejector pins or connecting fingers become thinner to meet fine-pitch requirements, then the precision requirement is met, but the structural strength becomes weak
Solution Approach 1:
The patent combines multiple testing pins into a integrated coaxial assembly where the first and second testing pins share a common central axis and are structurally coupled. This merging provides mutual support among the pins, enhancing the overall mechanical strength while maintaining the fine-pitch positioning capability of individual thin pins.
Solution Approach 2:
By nesting the first testing pin within the second testing pin in a coaxial configuration, the design allows thinner pins to support each other structurally. The outer pin provides mechanical reinforcement to the inner pin, enabling both to maintain thin profiles for precision while gaining collective structural strength.
3Measurement precision
If traditional ejector pins are used with high precision requirements, then the measurement precision improves, but the service lifetime becomes short due to wear and tear
Solution Approach 1:
The patent incorporates a concave spherical surface on the contact end of the second testing pin that matches the spherical shape of the terminal under test. This spherical contact geometry distributes mechanical stress more evenly during testing, reducing localized wear and extending the service lifetime while maintaining precise electrical contact for accurate measurements.
4Measurement precision
If double parallel ejector pins are placed close together, then the test resolution improves, but the structural strength becomes weak
Solution Approach 1:
The coaxial nesting arrangement allows two testing pins to be positioned very close together radially while the outer pin provides structural reinforcement to the inner pin. This configuration achieves fine-pitch measurement resolution comparable to parallel close-spaced pins but with enhanced mechanical strength due to the nested support structure.
Data Source
AI summary
Testing probe and semiconductor testing fixture, and their fabrication methods are provided. A plurality of first testing pins is formed on the substrate, each first testing pin including a first testing terminal on a top and a first connection terminal on a bottom. An insulating layer is formed on a sidewall surface of each first testing pin. A number of second testing pins are formed on the insulating layers, each second testing pin including a second testing terminal on a top thereof and a second connection terminal on a bottom thereof. A first concave surface is formed on a top of the second testing terminal, and surrounds a corresponding first testing pin.