Coaxial RF Bridge for Controlled Impedance in Electronic Packages
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Solution Overview
Problem
Existing electronic devices face challenges in maintaining signal quality at radio frequencies due to uncontrolled transmission line impedance changes and lack of shielding in non-RF interface components, which affects the connection between electronic IC chips and RF interface components.
Innovation Solution
The implementation of an RF bridge component that penetrates openings in the chip mounting substrate and RF connection chip, connecting the electronic IC chip to the RF interface component, while using a device level signal trace to align and connect RF interface components, ensuring minimal impedance change and maintaining signal quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If RF interface components are located on sidewalls of hermetic packages, then connection between RF components is enabled, but transmission line impedance changes uncontrolled and signal quality deteriorates
Solution Approach 1:
A coaxial extension structure is introduced as an intermediary component between the RF interface component and the hermetic package. This extension includes an inner conductor, outer conductor, and insulator that together form a controlled transmission line, mediating the connection to maintain controlled impedance while enabling sidewall mounting configuration.
Solution Approach 2:
The connection structure is divided into separate functional segments: the RF interface component, the coaxial extension (with inner conductor, outer conductor, and insulator), and the hermetic package. This segmentation allows each component to be optimized independently for its specific function while maintaining overall impedance control.
2Area of stationary object
If device footprint is reduced, then smaller device mounting substrates can be used, but alignment precision of RF interface components becomes more difficult to maintain
Solution Approach 1:
The RF interface connection is transitioned from a planar two-dimensional layout to a three-dimensional vertical configuration using the coaxial extension. This dimensional change allows RF components to be stacked vertically rather than arranged horizontally, reducing footprint while maintaining alignment precision through vertical positioning.
Solution Approach 2:
The inner conductor is nested within the outer conductor of the coaxial extension structure, creating a compact nested arrangement. This nesting enables the RF signal path to be contained within a small volume, reducing the overall device footprint while maintaining precise electrical connections.
Data Source
AI summary
An electronic device is provided. In particular, the electronic device includes (i) an electronic integrated circuit (IC) chip, (ii) a chip mounting substrate for mounting the electronic IC chip on a chip side of the chip mounting substrate, (iii) a radio frequency (RF) interface component disposed on an opposing side of the chip mounting substrate, the opposing side opposing the chip side, and (iv) an RF bridge component penetrating a first opening in the chip mounting substrate and configured to operably connect the electronic IC chip and the RF interface component.