Coaxial Socket Impedance Matching for High-Frequency Chip Testing
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Solution Overview
Problem
Traditional test sockets fail to meet the increasing demands of high-frequency chip testing due to insufficient inter-channel isolation and high inter-channel crosstalk, especially with the rise of digital high-definition 4K and PAM4 technology, which requires lower interference immunity and better performance.
Innovation Solution
A coaxial socket with an impedance matching structure is designed, comprising a metal test socket body and cover with polymer inserts and a test probe, featuring specific locking steps and a manufacturing method that includes baking polymers in a vacuum environment to achieve conductive and ground barrier structures for impedance matching and heat conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a traditional test socket structure is used, then the device complexity is low and manufacturing is simple, but the inter-channel isolation is insufficient and crosstalk is high
Solution Approach 1:
The patent employs composite material construction by integrating polymer insulating materials with metal conductive components (socket body, cover, and probes). The polymer material provides electrical insulation between channels while the metal components ensure good electrical connectivity and heat conduction. This composite approach achieves superior inter-channel isolation exceeding -40 dB without significantly complicating the manufacturing process.
2Temperature
If the socket body and cover are made of metal, then heat conduction and signal transmission are improved, but manufacturing precision requirements increase due to polymer stuffing and baking processes
Solution Approach 1:
The patent specifies performing the polymer stuffing process in a vacuum environment. This inert atmosphere prevents oxidation and contamination of the polymer material during stuffing, ensures consistent material properties, and eliminates air bubbles that could compromise the insulation performance. The vacuum environment maintains manufacturing precision while enabling the metal-polymer composite structure to achieve optimal heat conduction and electrical insulation properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides superior signal transmission and heat conduction, achieving insertion loss of −1 dB/40 GHz, return loss of −10 dB/40 GHz, and inter-channel isolation exceeding −40 dB/20 GHz, effectively shielding crosstalk and meeting the performance requirements of high-frequency chip testing.
Implementation Method 1
placing the test socket body and the built-in test socket cover that are stuffed with the polymers in an oven, baking them at 120° C. for 30 min, baking them at 155° C. for 30 min, and baking them at 190° C. for 60 min
Implementation Method 2
The test socket body and the test socket cover are made of conductive metal... quickly transfer heat generated during testing
Data Source
AI summary
The present invention relates to a coaxial socket of an impedance matching structure for semiconductor chip testing and a manufacturing method thereof. The coaxial socket includes a test socket locating substrate, a test socket body, a test socket cover, and a test probe. A polymer I and a polymer II are installed and fastened in the test socket body and the test socket cover respectively. A probe slot I and a probe slot II are provided in the polymer I and the polymer II respectively. The test probe is inserted through the probe slot I and the probe slot II. In the present invention, the test socket body and the test socket cover are made of conductive metal, and single-end impedance matching of 50 ohms or differential impedance matching of 100 ohms is performed between them and the probe, to achieve superb signal transmission and heat conduction.