Coaxial Optical Solder Head Layout for Stable Robot-Arm Alignment
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Solution Overview
Problem
Conventional non-contact soldering devices are bulky, complex, and prone to accuracy issues due to separate optical and soldering components, which complicates adjustments and reduces precision, especially when used on mobile platforms like robot arms.
Innovation Solution
Integration of an optical guiding assembly, sensor, and feedback controller as a system controller to create a compact, coaxial optical path system, reducing volume, weight, and instability, while allowing for easier maintenance and improved accuracy by separating dynamic and static components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the sensing light beam is collected coaxially, then the optical path alignment is simplified, but the adjustment of optical characteristics becomes very complicated and time-consuming
Solution Approach 1:
The patent pre-establishes a coaxial optical path structure where the sensing light beam and welding light beam share the same optical axis. This preliminary configuration of optical components (beam splitter, mirrors, lenses) ensures that alignment is built-in during manufacturing, eliminating the need for complex field adjustments and reducing adjustment time significantly.
Solution Approach 2:
The patent introduces a beam splitter as an intermediary component that separates the sensing light path from the welding light path while maintaining coaxial alignment. This mediator allows independent optimization of each optical path without compromising the overall alignment, simplifying both the alignment process and adjustment procedures.
2Device complexity
If the sensing light beam is collected non-coaxially, then the optical characteristics adjustment is simpler, but the volume of optical components becomes even larger
Solution Approach 1:
The patent transitions from a non-coaxial spatial arrangement to a coaxial arrangement by utilizing different optical dimensions and pathways. The sensing and welding beams share the same spatial axis but are separated temporally or spectrally through the beam splitter, reducing the lateral space required for optical components while maintaining adjustment simplicity.
3Ease of repair
If the light source and soldering module are independently installed, then the maintenance is easier, but the accuracy is easily reduced due to tolerance or assembling problems
Solution Approach 1:
The patent segments the system into modular components (light source module, soldering module, optical guiding assembly, sensor, feedback controller) that can be independently manufactured and maintained. Each module has standardized interfaces that ensure precise alignment when assembled, combining the benefits of independent maintenance with high manufacturing precision through modular design standards.
4Adaptability or versatility
If the soldering module is installed on a mobile vehicle, then the operational flexibility is improved, but the optical path system must be often adjusted due to positional movement
Solution Approach 1:
The patent merges the optical guiding assembly, sensor, and feedback controller into an integrated system controller that moves with the soldering module on the mobile vehicle. This combination ensures that the optical path remains stable relative to the soldering head, eliminating the need for frequent adjustments due to positional movements, while an independent light source allows operational flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated system controller enhances the accuracy and reduces the load on mobile platforms, making the soldering process more precise and efficient by minimizing volume and weight, and stabilizing the optical path.
Implementation Method 1
The light source emits waveband light. The waveband light is guided to a to-be-soldered area by the solder module for heating to perform a solder operation.
Implementation Method 2
The sensor is disposed on another side of the optical guiding assembly relative to the solder module for receiving a sensing light beam and generating a sensing signal according to a sensing result of the sensing light beam.
Data Source
AI summary
A solder device includes a light source, a solder module, an optical guiding assembly, a sensor and a feedback controller. The light source emits waveband light guided to a to-be-soldered area for heating. The optical guiding assembly is disposed between the light source and the solder module, and the waveband light is guided to the solder module by the optical guiding assembly. The sensor is disposed on another side of the optical guiding assembly for receiving a sensing light beam and then generating a sensing signal. The sensing light beam is guided to the sensor by the optical guiding assembly. The feedback controller is connected with the sensor and the light source for receiving the sensing signal and then controlling the light source. The optical guiding assembly, the sensor and the feedback controller are integrated as a system controller. Therefore, the volume and weight of the solder module are compacted.