Coaxial Test Socket Structure for High-Speed Signal Integrity
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Solution Overview
Problem
Current test sockets are limited in maintaining signal integrity at data transfer rates higher than 30 gigabits per second, which is insufficient for advanced applications like 5G telecommunications and artificial intelligence.
Innovation Solution
A test socket design featuring a conductive body with signal, ground, and power cavities, along with corresponding probes, that electrically connect to a PCB and IC chip, providing improved electrical coupling and shielding to maintain signal integrity at higher data transfer rates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional test socket designs are used, then manufacturing and assembly are simpler, but signal integrity deteriorates at data transfer rates above 30 gigabits per second
Solution Approach 1:
The test socket is divided into separate functional components: a conductive body with integrated cavities, individual signal probes, ground probes, and an insulating body. This segmentation allows each component to be optimized for its specific function while maintaining overall signal integrity at high data transfer rates.
Solution Approach 2:
The signal probe and ground probe are positioned within cavities of the conductive body, creating a nested coaxial structure. The insulating body further encases these components, forming multiple nested layers that provide shielding and maintain signal integrity while managing complexity through hierarchical organization.
2Productivity
If higher data transfer rates are implemented, then productivity and application capability improve, but signal integrity deteriorates due to increased electromagnetic interference and signal distortion
Solution Approach 1:
The conductive body with its signal cavity and ground cavity acts as an intermediary structure between the signal probe and external environment. This coaxial configuration provides electromagnetic shielding that mediates against interference, allowing high data transfer rates to be achieved while maintaining signal integrity through reduced electromagnetic coupling with external sources.
3Reliability
If coaxial configuration with separate signal and ground cavities is used, then signal integrity at high data transfer rates is maintained, but manufacturing precision requirements increase
Solution Approach 1:
The signal cavity and ground cavity are merged into a single integrated conductive body structure rather than being separate components. This integration reduces the number of assembly steps and alignment requirements, lowering manufacturing precision demands while maintaining the beneficial coaxial configuration for signal integrity at high data transfer rates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances signal integrity and allows for increased data transfer rates by ensuring reliable electrical connections and reduced signal distortion, meeting the demands of advanced applications.
Implementation Method 1
The ground probe is further electrically connected to the conductive body
Data Source
AI summary
A test socket for coupling an integrated circuit (IC) chip to a printed circuit board (PCB) is provided. The test socket includes a conductive body having a first surface configured to face the PCB and a second surface configured to face the IC chip. The conductive body defines a signal cavity and a ground cavity extending from the first surface to the second surface. The test socket further includes a signal probe disposed in the signal cavity. The signal probe is configured to electrically connect to a signal conductor of the PCB and to a signal pad of the IC chip. The test socket further includes a ground probe disposed in the ground cavity. The ground probe is configured to electrically connect to a ground conductor of the PCB and to a ground pad of the IC chip. The ground probe is further electrically connected to the conductive body.