Coaxial Semiconductor Testing Probe Design

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional semiconductor testing probes face challenges such as low manufacturing precision, weak structural strength, short lifespan, and low measurement resolution due to shrinking dimensions and high precision requirements, leading to measurement inaccuracies and wear and tear issues.

Innovation Solution

A coaxial testing probe design featuring an insulating body with a first testing pin and a second testing pin integrated into one probe, where the second testing pin surrounds the first and is electrically isolated, providing enhanced mechanical strength and precise distance control, and an elastic member drives the first testing pin's upward and downward movement to maintain consistent contact.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the dimensions of testing pins are reduced to accommodate shrinking IC chip dimensions, then the testing probe can test smaller chips, but the manufacturing precision becomes too stringent to meet and structural strength weakens

Engineering Contradiction:

Improvetesting pin dimensionVSAvoidmanufacturing precision

Core Design Contradiction:

Volume of moving objectVSManufacturing precision

Solution Approach 1:

The testing probe is segmented into multiple functional components: an insulating body, a first testing pin for electrical contact, a second testing pin for reference measurement, and an elastic member for applying force. This segmentation allows each component to be optimized independently, enabling the testing pins to be made thinner while maintaining overall probe functionality and manufacturing feasibility

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The first testing pin is disposed inside the insulating body, and the second testing pin is disposed around the outer sidewall of the insulating body, creating a nested configuration. This nested structure allows the testing pins to be integrated within a compact probe assembly, maintaining precise spatial relationships without requiring extremely tight manufacturing tolerances for the entire probe

Inventive Principle:

Principle #7Nested doll (Nesting)

2Volume of moving object

If the dimensions of testing pins are reduced to accommodate shrinking IC chip dimensions, then the testing probe can test smaller chips, but the structural strength becomes weaker

Engineering Contradiction:

Improvetesting pin dimensionVSAvoidstructural strength

Core Design Contradiction:

Volume of moving objectVSStrength

Solution Approach 1:

The testing probe uses composite material construction: an insulating body material that provides electrical isolation and mechanical support, metal testing pin materials for electrical conductivity and strength, and elastic member materials for flexible force application. This composite approach allows each material to contribute its optimal properties, enabling thin testing pins with sufficient structural strength

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The second testing pin is configured to surround the outer sidewall of the insulating body, creating a curved or circumferential arrangement. This curved configuration distributes mechanical stress more evenly compared to straight pins, enhancing the structural strength of the thin testing pins

Inventive Principle:

Principle #14Spheroidality (Curvature)

3Volume of moving object

If the dimensions of testing pins are reduced, then the testing probe can accommodate smaller chips, but the lifespan becomes shorter due to increased wear and tear

Engineering Contradiction:

Improvetesting pin dimensionVSAvoidlifespan

Core Design Contradiction:

Volume of moving objectVSDuration of action of stationary object

Solution Approach 1:

The probe uses a second testing pin that surrounds the insulating body as a reference or backup contact point. This redundant testing pin configuration allows the system to continue functioning even if the first testing pin wears out, effectively extending the operational lifespan of the probe

Inventive Principle:

Principle #26Copying

Solution Approach 2:

The elastic member is configured to drive upward or downward movement of the first testing pin, allowing it to be pushed down during testing and then recovered to its original position. This repeated compression and recovery action distributes wear over time and allows the testing pin to maintain contact pressure without permanent deformation

Inventive Principle:

Principle #34Discarding and recovering

4Volume of moving object

If the dimensions of testing pins are reduced, then the testing probe can accommodate smaller chips, but the measurement resolution becomes lower

Engineering Contradiction:

Improvetesting pin dimensionVSAvoidmeasurement resolution

Core Design Contradiction:

Volume of moving objectVSMeasurement precision

Solution Approach 1:

The insulating body acts as an intermediary structure that precisely positions and electrically isolates the first and second testing pins. This intermediary component maintains a fixed, known distance between the testing pins, enabling accurate measurement calculations even when the pins themselves are very thin

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The elastic member enables dynamic adjustment of the first testing pin's position through upward and downward movement. This dynamic positioning allows the testing pin to maintain optimal contact with the test terminal while compensating for variations in terminal height, thereby maintaining measurement resolution despite the pin's reduced dimensions

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances mechanical strength, improves measurement resolution, extends the lifespan of the testing probe by compensating for wear and tear, and ensures accurate electrical characteristics testing by maintaining consistent contact with the test terminals.

Implementation Method 1

An elastic member is disposed inside the chamber and attached to the first testing pin to drive an upward or downward movement of the first testing pin along the chamber

Methodology Applied

Scientific EffectElasticity: Elasticity

Data Source

PatentUS10006939B2Testing probe and semiconductor testing fixture, and fabrication methods thereof

Publication Date: 2018.06.26 NANTONG FUJITSU MICROELECTRONICS

AI summary

Testing probe and semiconductor testing fixture, and their fabrication methods are provided. A testing probe may configure a chamber through an insulating body. A first testing pin is disposed inside the chamber of the insulating body. The first testing pin includes: a first testing terminal on one end of the first testing pin and a first connection terminal on another end of the first testing pin. An elastic member is disposed inside the chamber and attached to the first testing pin to drive an upward or downward movement of the first testing pin along the chamber. A second testing pin is disposed around an outer sidewall surface of the insulating body enclosing the first testing pin. The second testing pin includes a second testing terminal on one end of the second testing pin and a second connection terminal on another end of the second testing pin.