Coaxial Semiconductor Testing Probes for Miniaturized Devices
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Solution Overview
Problem
Conventional semiconductor testing fixtures using double top-probes or gold-fingers face limitations such as low manufacturing accuracy, structural strength, short lifespan, and low testing accuracy due to the miniaturization of semiconductor devices, which affects the reliability and efficiency of electrical testing.
Innovation Solution
A semiconductor testing fixture with a substrate having a plurality of testing regions and probes with a predetermined distribution pattern, featuring a first testing tip, an insulation layer, and a coaxial second testing tip surrounding the first, which improves mechanical strength and testing accuracy by reducing distance between probes and preventing deformation during testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of top-probes and gold-fingers is reduced to match miniaturized semiconductor terminals, then the testing fixture can accommodate smaller devices, but the manufacturing accuracy deteriorates
Solution Approach 1:
The patent implements a coaxial probe structure where an inner probe is nested within an outer probe, both sharing the same central axis. This nested configuration allows the testing fixture to maintain larger effective dimensions for improved manufacturing accuracy while still accommodating miniaturized semiconductor terminals through the reduced overall footprint of the coaxial arrangement.
Solution Approach 2:
The patent transitions from a conventional single-probe or side-by-side probe arrangement to a three-dimensional coaxial configuration. By utilizing the radial dimension and arranging probes along the central axis, the invention achieves improved manufacturing accuracy through larger effective probe dimensions while maintaining compatibility with miniaturized devices through the vertical stacking approach.
2Length of moving object
If the top-probes and gold-fingers are made thinner to fit limited space on tested terminals, then the testing fixture can access smaller terminals, but the structural strength deteriorates
Solution Approach 1:
The inner probe is nested within the outer probe in a coaxial arrangement, allowing both probes to share the same space efficiently. This nested structure provides mutual support, where the outer probe reinforces the inner probe and vice versa, thereby maintaining structural strength without increasing the overall thickness beyond what is needed for accessing small terminals.
Solution Approach 2:
The coaxial probe structure functions as a composite testing element where two separate probe structures work together. The combination of inner and outer probes creates a composite system with enhanced mechanical properties, providing both the thin profile needed for small terminals and the structural strength through the combined configuration.
3Length of moving object
If the top-probes and gold-fingers are made thinner to fit limited space, then the testing fixture can access smaller terminals, but the lifespan deteriorates
Solution Approach 1:
The nested coaxial probe structure provides mutual protection and support, reducing wear on individual probes. The outer probe protects the inner probe from lateral stresses and the inner probe provides structural reinforcement, thereby extending the lifespan of both components despite their thin profiles required for accessing small terminals.
Solution Approach 2:
The coaxial arrangement provides inherent mechanical cushioning and stress distribution. The dual-probe structure anticipates and distributes mechanical stresses that would otherwise concentrate on a single thin probe, thereby preventing premature wear and extending operational lifespan before failure occurs.
4Length of stationary object
If the distance between two probes is reduced to test miniaturized devices, then the testing fixture can accommodate smaller devices, but the testing accuracy deteriorates
Solution Approach 1:
By nesting the inner probe within the outer probe in a coaxial arrangement, the invention achieves extremely close probe spacing (effectively zero lateral distance) while maintaining accurate positioning through the shared central axis. This eliminates lateral misalignment errors that would occur with conventional side-by-side probes at similar distances.
Solution Approach 2:
The patent moves the probe spacing problem from the lateral dimension to the vertical dimension through coaxial stacking. This dimensional transition allows the probes to be extremely close in the lateral plane (improving accuracy for small terminals) while managing any vertical misalignment through the rigid coaxial structure and alignment features.
Data Source
AI summary
A semiconductor testing fixture is provided. The semiconductor testing fixture includes a substrate having a plurality of testing regions; and a plurality of testing probes with a predetermined distribution pattern formed on the substrate in each of the plurality of testing regions. Etch of the testing probes comprises a first testing tip; an insulation layer formed on a side surface of the first testing tip; and a second testing tip being coaxial with the first testing tip and surrounding the first testing tip formed on a side surface of the insulation layer.