Coaxial Two-Fluid Nozzle for Substrate Cleaning
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Solution Overview
Problem
Conventional two-fluid cleaning apparatuses struggle to effectively remove particles from minute recesses on semiconductor substrates due to the shallow incident angle of shock waves, resulting in inadequate cleaning performance.
Innovation Solution
A substrate cleaning apparatus that utilizes a two-fluid nozzle system with a second two-fluid jet traveling at a higher velocity than the first, causing the second jet to converge and increase the incident angle of shock waves to nearly 90 degrees, allowing for effective removal of particles from recesses, combined with a pulsating flow rate and droplet formation to enhance cleaning efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional two-fluid jet is supplied onto the substrate surface, then the substrate surface is cleaned, but the incident angle of shock waves is small causing particles in minute recesses to remain
Solution Approach 1:
The single jet nozzle is segmented into a first jet nozzle and a second jet nozzle arranged coaxially. The first jet nozzle emits a first two-fluid jet, while the second jet nozzle emits a second two-fluid jet at a higher velocity that surrounds the first jet nozzle. This segmentation allows the second jet to converge and increase the incident angle of shock waves to nearly 90 degrees, enabling effective removal of particles from minute recesses that a single jet cannot address.
2Productivity
If the gas supply valve is opened and closed with a short period, then the two-fluid mixture flow rate pulsates, but the amplitude is small due to residual pressure in the gas pocket
Solution Approach 1:
The gas supply valve is opened and closed periodically with a short period to create pulsating flow of the two-fluid mixture. This periodic action causes the flow rate to vary, creating pulsating jets that enhance cleaning efficiency by repeatedly impacting particles in recesses with different force levels, thereby improving overall cleaning performance despite the small amplitude limitation.
3Object-affected harmful factors
If a two-fluid jet is supplied onto the substrate surface, then particles are removed, but fine particles down to 100 nm in size remain in recesses
Solution Approach 1:
The velocity parameter of the two-fluid jet is changed by introducing a second jet nozzle that operates at a higher velocity than the first jet nozzle. This parameter change increases the incident angle of shock waves to nearly 90 degrees, enabling the jet to effectively impinge on and remove fine particles down to 100 nm in size that are located in minute recesses on the substrate surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves improved cleaning efficiency by ensuring that shock waves impinge on particles in recesses, effectively removing fine particles down to 100 nm in size, thereby enhancing the overall cleaning performance.
Implementation Method 1
generate shock waves by a collision between the two-fluid jet and the substrate W
Implementation Method 2
the second two-fluid jet travels toward the surface of the substrate while surrounding the first two-fluid jet. Since there is a difference in velocity between the first two-fluid jet and the second two-fluid jet, the second two-fluid jet converges due to a contact with the first two-fluid jet
Implementation Method 3
A jet of the two-fluid mixture that is pulsating in this manner is delivered onto the surface of the substrate
Data Source
AI summary
A substrate cleaning apparatus capable of removing particles that exist in minute recesses formed on a substrate surface is disclosed. The substrate cleaning apparatus includes a substrate holder configured to hold a substrate; and a two-fluid nozzle configured to deliver a two-fluid jet onto a surface of the substrate. The two-fluid nozzle includes a first jet nozzle configured to emit a first two-fluid jet and a second jet nozzle configured to emit a second two-fluid jet at a velocity higher than a velocity of the first two-fluid jet, and the second jet nozzle surrounds the first jet nozzle.