Coaxial Through-Package Vertical Interconnect for Ground Separation
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Solution Overview
Problem
Traditional semiconductor packaging substrates rely on single plated through holes (PTHs) for signal routing, which determine performance and area occupancy, limiting efficiency and ground separation.
Innovation Solution
A coaxial approach is implemented where signals are routed within a concentric reference conductor, forming a coaxial structure with through-vias in insulative or conductive semiconductor substrates, reducing area usage and improving performance by using a concentric reference structure and through-vias.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If traditional plated through holes (PTHs) are used for signal routing, then signal transmission is achieved, but area occupancy is large and ground separation is insufficient
Solution Approach 1:
The patent implements a coaxial structure where the signal conductor is nested within the concentric reference conductor. This nesting arrangement allows the signal path to be contained within the reference conductor structure, effectively reducing the area required for each interconnect while maintaining proper ground separation through the concentric geometry.
Solution Approach 2:
The patent transitions from a planar PTH structure to a three-dimensional coaxial structure. By utilizing the radial dimension within the reference conductor, the design achieves better ground separation and reduced area occupancy compared to traditional two-dimensional PTH layouts.
2Reliability
If traditional PTHs are used for signal routing, then signal transmission is achieved, but performance is limited
Solution Approach 1:
The coaxial structure with nested conductors provides superior electromagnetic shielding and controlled impedance characteristics, directly improving signal transmission performance. The nested geometry naturally provides reference planes and reduces crosstalk, enhancing overall device performance despite the increased structural complexity.
3Area of stationary object
If PTH pitch is reduced to improve density, then area occupancy decreases, but manufacturing precision requirements increase
Solution Approach 1:
The patent segments the interconnect structure into multiple functional layers: the signal conductor, the concentric reference conductor, and dielectric materials. This segmentation allows each component to be optimized independently, enabling reduced area occupancy while maintaining manufacturable pitch dimensions through modular construction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances performance and reduces area occupancy by efficiently routing signals within a concentric reference conductor, offering improved signal routing efficiency and ground separation compared to traditional PTH-based substrates.
Implementation Method 1
depositing over the inner surface of the hole in the insulative semiconductor substrate a conductive material to form the concentric reference structure
Implementation Method 2
depositing a first dielectric material in the hole; depositing a second dielectric material on the surface of the first and second sides
Data Source
AI summary
In integrated circuit packages, a coaxial pair of signals are routed through a plated through hole between circuitry on one face of the core substrate material with circuitry on an opposing face of the core substrate material. Provided are methods and apparatuses where signals are routed within a concentric reference conductor within traditional package substrates. Methods for forming a hole in the core substrate material through which the coaxial pair of signals is passed on a fine pitch.