Coaxial Wire Connection Structure With Plated Through-Hole Shielding

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Solution Overview

Problem

The miniaturization of electronic components has made it difficult to solder conducting wires with reduced diameters, particularly coaxial wires, as it requires stripping multiple layers and can result in heat transfer to the insulator or shield, causing them to melt during soldering, leading to unstable connections.

Innovation Solution

An electric-wire-equipped connection member featuring a center conductor, insulating layer, and metal shield layer, where the insulating substrate has a through hole with a continuous metal plating layer, allowing the shield layer to be electrically connected and reducing heat transfer during soldering, enabling stable connection to a circuit board.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If conducting wires with reduced diameters are used for miniaturization, then electronic component size is reduced, but soldering becomes difficult and heat transfer causes insulator or shield melting

Engineering Contradiction:

Improveelectronic component sizeVSAvoidconnection stability

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The connection member is divided into distinct functional regions: a first region with the through hole and metal plating layer for shield connection, and a second region for center conductor connection. This segmentation allows separate optimization of soldering processes for each conductor type, improving reliability while maintaining miniaturization.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The metal plating layer formed on the inner peripheral surface of the through hole acts as an intermediary between the shield layer and the circuit board. This intermediate layer facilitates reliable electrical connection and heat dissipation during soldering, preventing direct heat transfer to the insulator or shield that would cause melting.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of manufacture

If multiple layers are stripped from coaxial wires for soldering, then electrical connection is achieved, but the process becomes complex and time-consuming

Engineering Contradiction:

Improvesoldering process simplicityVSAvoidconnection preparation time

Core Design Contradiction:

Ease of manufactureVSLoss of time

Solution Approach 1:

The metal plating layer is pre-formed on the inner peripheral surface of the through hole before the electric wire is installed. This preliminary preparation eliminates the need for complex multi-layer stripping operations during assembly, as the shield layer can be directly connected to the pre-existing plating layer, significantly reducing preparation time and simplifying the manufacturing process.

Inventive Principle:

Principle #10Preliminary action

3Strength

If heat is applied during soldering of reduced-diameter wires, then electrical connection is formed, but heat transfer melts the insulator or shield layer

Engineering Contradiction:

Improveelectrical connection strengthVSAvoidheat transfer to insulator or shield

Core Design Contradiction:

StrengthVSTemperature

Solution Approach 1:

The metal plating layer serves as a thermal intermediary between the solder joint and the sensitive insulator or shield layer. During soldering, this intermediate metal layer absorbs and dissipates heat more effectively, preventing direct heat transfer to the insulator or shield that would cause melting, while still enabling strong electrical connection.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention changes the thermal parameters of the connection structure by introducing a metal plating layer with superior thermal conductivity compared to the insulator or shield materials. This parameter change allows controlled heat distribution during soldering, enabling strong electrical connections without exceeding the thermal tolerance of the insulator or shield layer.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration allows for stable and simplified connection of the electric wire to the circuit board, avoiding the melting of insulators and shields, and facilitating high-speed signal transmission by maintaining impedance matching without the need to expose and strip layers.

Implementation Method 1

the shield layer is electrically connected to the metal plating layer

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

reducing heat transfer during soldering, enabling stable connection to a circuit board

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS20240178590A1Electric-wire-equipped connection member and electric wire connection structure

Publication Date: 2024.05.30 SUMITOMO ELECTRIC INDUSTRIES LTD

AI summary

An electric-wire-equipped connection member includes: an electric wire including a center conductor, an insulating layer covering the center conductor, and a shield layer made of metal and covering the insulating layer; and an insulating substrate including a first surface and a second surface and having a through hole which has openings in the first surface and the second surface and in which a portion of the electric wire where the shield layer is exposed is inserted. The center conductor is exposed from the first surface of the insulating substrate. The insulating substrate includes a metal plating layer formed continuously on an inner peripheral surface of the through hole and at least one of the first surface and the second surface. The shield layer is electrically connected to the metal plating layer.