Chip-on-Board Fingerprint Sensor Integration
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Solution Overview
Problem
Conventional fingerprint sensor systems are complex, costly, and have a lower mean time between failure due to multiple specialized components, making them unsuitable for widespread adoption in cost-effective systems.
Innovation Solution
A low-cost fingerprint sensor system is developed using a simplified design with a printed circuit board (PCB) or printed wire board, featuring a fingerprint sensor array fabricated directly onto the board and an integrated circuit die mounted using chip-on-board technology, reducing component count and signal distortion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional fingerprint sensor systems use multiple specialized components mounted on a PCB with IC packages, then the system achieves functional requirements for fingerprint authentication, but the system complexity increases and manufacturing cost increases
Solution Approach 1:
The patent merges the fingerprint sensor array and integrated circuit die into a single unified structure where the IC die is mounted directly on the PCB substrate using chip-on-board technology, eliminating the need for separate IC packages and reducing the number of discrete components while maintaining all necessary functional capabilities for fingerprint authentication
Solution Approach 2:
The PCB substrate serves multiple functions simultaneously: it acts as the mechanical support structure, the electrical interconnection medium through vias, and the mounting platform for the IC die, thereby eliminating the need for separate specialized components and reducing overall system complexity
2Reliability
If conventional fingerprint sensor systems use multiple specialized components with IC packages, then the system achieves required functionality, but the manufacturing cost increases
Solution Approach 1:
The patent combines multiple discrete components into a single integrated assembly where the IC die is directly mounted on the PCB using chip-on-board technology, eliminating the need for expensive IC packages and reducing the number of assembly steps, thereby significantly reducing manufacturing cost while maintaining functional reliability
Solution Approach 2:
The patent extracts and eliminates the unnecessary IC package layer from the conventional design, mounting the IC die directly on the PCB substrate, which removes the added cost and complexity of packaging while preserving all essential functional capabilities
3Reliability
If conventional fingerprint sensor systems use multiple specialized components, then the system achieves functional requirements, but the mean time between failure decreases
Solution Approach 1:
The patent merges the fingerprint sensor array and IC die into a single integrated structure with direct electrical connections through PCB vias, eliminating multiple connection points and interfaces that could fail, thereby increasing the mean time between failure while maintaining functional reliability
Data Source
AI summary
Low cost fingerprint system having a single chip solution includes a circuit board, a fingerprint sensor array fabricated onto a first surface of the circuit board, and an integrated circuit die for processing information received from the fingerprint sensor array is mounted directly to a second surface of the circuit board. The integrated circuit die may be electrically connected to the sensor by, for example, vias in the circuit board.