COB Laser Diode Interface Mating via Capacitor-Resistor Network
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Solution Overview
Problem
Conventional small hot plug and unplug modules with coaxial schemes have high production costs due to the need for headers and caps, and complex assembly processes, making it difficult to mate a package chip driver with a COB-bonded laser diode interface.
Innovation Solution
A COB-bonding laser diode interface mating device featuring a bare die light-emitting chip directly bonded to a circuit board, connected via a capacitor-resistor network to a package chip driver integrated circuit, eliminating the need for headers and caps, and including a control circuit for real-time monitoring and stability maintenance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a coaxial scheme is used with header and cap, then the laser diode interface can be protected and structured, but the production cost increases and the device structure becomes complex
Solution Approach 1:
The patent removes the header and cap components from the laser diode assembly, extracting only the essential functional elements (laser chip, lens, and circuit board) while eliminating unnecessary protective structures. This reduces device complexity and cost while maintaining interface functionality through direct mounting of the laser chip to the circuit board.
2Device complexity
If a coaxial scheme with header and cap is used, then the laser diode can be structured, but the manufacturing process becomes complicated and productivity decreases
Solution Approach 1:
The patent merges the laser chip mounting and circuit board integration into a single COB bonding process, eliminating the need for separate header and cap assembly steps. The lens is directly integrated with the circuit board, and the laser chip is bonded directly to the board, reducing the number of manufacturing steps and improving productivity.
3Reliability
If a package chip driver is used, then thermal dissipation and performance-to-cost ratio are improved, but the interface mating with COB-bonded laser diode becomes difficult
Solution Approach 1:
The patent introduces a capacitor-resistor network as an intermediary between the package chip driver and the COB-bonded laser diode. This network serves as a buffer and interface adapter, enabling electrical connection between the packaged driver chip and the bare die laser chip while accommodating the different interface requirements of each component.
4Reliability
If header and cap are included in conventional devices, then the laser diode interface can be protected, but the production cost increases
Solution Approach 1:
The patent replaces expensive reusable header and cap components with a cost-effective COB bonding approach where the laser chip is directly mounted to the circuit board. The circuit board itself serves as the protective and structural element, eliminating the need for additional expensive metallic headers and caps while maintaining interface protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces production costs, simplifies the device structure, eliminates the device-to-module assembly process, and enhances manufacturing efficiency by enabling easy interface mating between the COB-bonded laser diode and driver integrated circuit.
Implementation Method 1
the capacitor-resistor network allows the driver integrated circuit to provide a bias current and a modulation current to the laser diode such that the laser diode is in an activated state
Implementation Method 2
the laser diode has a lens covering on the light-emitting chip and the backlight chip
Implementation Method 3
the backlight chip receives backlight emitted from the light-emitting chip and reflected by the lens, and converts the optical signal into an electrical signal
Data Source
AI summary
A COB bonding laser diode interface mating device comprises a laser diode and a driver integrated circuit (2). The laser diode includes a light-emitting chip (11). The light-emitting chip (11) is a bare die directly bonded to a circuit board. The driver integrated circuit (2) is a driver chip that is a packaged chip. The light-emitting chip (11) and the driver chip are connected through a capacitor-resistor network (3). The capacitor-resistor network (3) allows the driver integrated circuit (2) to provide a bias current and a modulation current to the laser diode such that the laser diode is in an activated state. The capacitor-resistor network (3) realizes interface mating between the COB bonding laser diode and the driver integrated circuit (2), thereby solving a problem that the interface mating cannot be easily achieved, reducing costs, and improving production efficiency.