COB LED Dissipation Unit Array for Thermal Management
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Solution Overview
Problem
Chip on board (COB) LED devices face insufficient thermal dissipation issues due to space constraints, leading to overheating and performance degradation or damage, as existing heat dissipation methods are inadequate for effectively managing heat in densely packed LED circuits.
Innovation Solution
A COB LED device design incorporating a thermal layer with a conductive material and a dissipation unit array that thermally couples the LED device to a printed circuit board's thermal projection, enhancing heat dissipation through a plurality of dissipation units, allowing for both thermal and electronic coupling between the LED and PCB components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If LED chips are densely packed in COB technology to increase performance, then circuit performance increases, but thermal dissipation becomes insufficient leading to overheating
Solution Approach 1:
The dissipation unit array divides the heat dissipation function into multiple independent dissipation units, each capable of conducting heat from the LED chip to the PCB. This segmentation allows heat to be distributed across multiple pathways rather than relying on a single heat dissipation route, effectively managing thermal load in densely packed LED circuits
Solution Approach 2:
The dissipation units serve multiple functions simultaneously: they provide thermal conduction from LED chip to PCB, electrical connection between contact pads and electrode pads, and mechanical support for mounting the LED device on the PCB. This multi-functionality resolves the contradiction by integrating heat dissipation with other necessary functions
2Temperature
If dissipation units are added to improve heat dissipation, then thermal management improves, but device complexity increases
Solution Approach 1:
The dissipation units combine thermal conduction, electrical connection, and mechanical support functions into a single integrated component. By merging these functions, the patent avoids adding separate heat sinks, electrical connectors, and mounting structures, thus improving heat dissipation without proportionally increasing device complexity
Solution Approach 2:
The dissipation units act as intermediary components between the LED device and the PCB, providing a bridge that simultaneously addresses thermal, electrical, and mechanical requirements. This intermediary approach allows heat dissipation improvement while maintaining a relatively simple overall structure through standardized interface components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively improves heat dissipation in COB LED devices, preventing overheating and ensuring reliable performance by thermally coupling the LED's thermal layer with the PCB's thermal projection via dissipation units, thus enhancing the thermal management of densely packed LED circuits.
Implementation Method 1
The thermal layer is thermally coupled to the thermal projection via at least one of the plurality of dissipation units
Data Source
AI summary
A chip on board light emitting diode (LED) device includes a LED device, a printed circuit board (PCB) and a dissipation unit array. The LED device includes a LED substrate, a first contact pad and a second contact pad above the LED substrate and a thermal layer formed on top surface of the LED device. The thermal layer includes a thermal conductive material. A printed circuit board (PCB) includes a PCB substrate with a thermal projection extending from surface of the PCB substrate, and a first and a second electrode pads above the PCB substrate. The thermal projection and the PCB substrate include the thermal conductive material. The dissipation unit array includes a plurality of dissipation units each disposed between the LED device and the PCB. The thermal layer is thermally coupled to the thermal projection via at least one dissipation unit. Each of the first and second contact pads is electrically coupled to the corresponding electrode pad via at least one dissipation unit.