Chip-on-Board LED Package Dual Frame Heat Dissipation

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Solution Overview

Problem

Chip-on-board type light emitting device packages face challenges in heat-dissipating characteristics and manufacturing cost, requiring improved structural reliability and heat-dissipating efficiency to maintain market competitiveness.

Innovation Solution

A dual frame structure with a base frame and electrode frame separated by a molding part, featuring through-holes and penetration holes filled with molding material to enhance bonding and heat dissipation, along with a manufacturing method that includes forming a molding part to maintain spacing between frames and prevent short-circuits.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a chip-on-board type package is used to improve heat-dissipating characteristics, then heat dissipation efficiency is improved, but structural reliability deteriorates due to potential short-circuits between frames

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidstructural reliability

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

A molding part is introduced as an intermediary substance between the base frame and electrode frame. This molding part serves multiple functions: it maintains the spaced-apart relationship between frames to prevent short-circuits, provides thermal pathways for heat dissipation, and ensures structural reliability by bonding the frames together while maintaining electrical isolation.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If frames are spaced apart to prevent short-circuits, then structural reliability is improved, but device complexity increases due to additional spacing requirements

Engineering Contradiction:

Improvestructural reliabilityVSAvoiddevice complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The spacing function, thermal management function, and structural bonding function are merged into a single molding part. This integrated approach eliminates the need for separate spacing elements, thermal pathways, and bonding structures, thereby maintaining structural reliability while reducing overall device complexity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The molding part is designed to perform multiple functions simultaneously: it acts as a spacer to maintain frame separation, provides thermal conduction pathways for heat dissipation, and serves as a bonding agent to secure the frames together. This multi-functionality reduces the number of components needed while ensuring reliability.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Temperature

If a dual frame structure with spacing is implemented, then heat-dissipating efficiency is improved, but manufacturing cost increases

Engineering Contradiction:

Improveheat-dissipating efficiencyVSAvoidmanufacturing cost

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

Multiple functions (spacing, thermal management, bonding) are combined into a single molding part that can be formed and attached in one manufacturing step. This integration reduces the number of assembly operations, minimizes the need for separate components, and simplifies the manufacturing process, thereby reducing overall manufacturing costs despite the enhanced heat-dissipating capabilities.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution improves structural reliability and heat-dissipating efficiency while reducing manufacturing costs, enabling effective heat dissipation and preventing short-circuits in chip-on-board type light emitting device packages.

Implementation Method 1

The base frame has a first penetration hole penetrating through an inner portion thereof, the first penetration hole being filled with the molding part, such that bonding between the base frame and the molding part is enhanced

Methodology Applied

Scientific EffectCapillary action: Capillary Action

Implementation Method 2

bonding between the base frame and the molding part is enhanced

Methodology Applied

Scientific EffectAdhesion: Adhesive

Implementation Method 3

chip-on-board type package has a heat transfer path less complicated than that of the surface mount device type package, such that heat-dissipating characteristics may be improved

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9748459B2Method for manufacturing improved chip-on-board type light emitting device package and such manufactured chip-on-board type light emitting device package

Publication Date: 2017.08.29 LUMENS CO LTD

AI summary

There are provided a chip-on-board type light emitting device package capable of improving structural reliability and heat-dissipating efficiency and reducing a manufacturing cost, and a method for manufacturing the same. The chip-on-board type light emitting device package includes: a dual frame including a base frame on which a plurality of light emitting devices are mounted and an electrode frame positioned above the base frame so as to be spaced apart from the base frame and including two electrodes separated from each other; and a molding part coupled to the dual frame so that the base frame and the electrode frame are spaced apart from each other and having an opening through which light generated in the plurality of light emitting devices is to be emitted, wherein the base frame has a through-hole through which the electrode frame is exposed.