COB LED Module Light Guide Panel Integration
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Solution Overview
Problem
Conventional backlight units (BLUs) using packaged LEDs have inefficient light connection structures, leading to reduced light incidence efficiency and increased manufacturing costs due to separate substrates, which limits the reduction of the BLU's outer thickness.
Innovation Solution
A chip-on-board (COB) type LED module is used, where LED chips are directly mounted on a substrate, and a light guide panel with insertion recesses and an adhesive layer is employed to maximize light incidence efficiency, eliminating gaps and reducing thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If packaged LEDs with separate substrates are used, then the LED module can be manufactured with standardized components, but the connection structure between LED module and light guide panel becomes inefficient and the outer thickness of BLU increases
Solution Approach 1:
The patent merges the LED chip mounting substrate and the light guide panel into a single integrated structure. The LED chips are directly mounted on the light guide panel substrate, eliminating the need for separate package substrates and intermediate connection structures, thereby reducing the overall thickness of the backlight unit while maintaining standardized manufacturing capabilities
Solution Approach 2:
The patent extracts and eliminates the intermediate package substrate layer from the conventional LED structure. By removing this unnecessary intermediate layer and directly mounting LED chips on the light guide panel, the design achieves thickness reduction while preserving the essential functionality of both components
2Ease of manufacture
If packaged LEDs with separate substrates are used, then the LED module can be assembled with modular components, but the number of manufacturing processes increases and manufacturing cost increases
Solution Approach 1:
The patent combines multiple separate manufacturing processes into a single integrated process. By directly mounting LED chips on the light guide panel substrate, the patent eliminates intermediate assembly steps such as bonding LEDs to separate package substrates and then bonding those packages to the light guide panel, thereby reducing the total number of manufacturing processes and improving production efficiency
Solution Approach 2:
The patent performs preliminary preparation of the light guide panel substrate with mounting structures and optical features before LED chip attachment. This preliminary action integrates multiple functions into the substrate design itself, allowing subsequent LED mounting to be performed in a single streamlined process rather than requiring multiple sequential assembly operations
3Ease of manufacture
If packaged LEDs are used with separate substrates, then the LED module can be manufactured with standard packaging, but light emitted from LED module is partially reflected and lost reducing incidence efficiency
Solution Approach 1:
The patent extracts and removes the package substrate layer that causes light reflection and loss. By eliminating this intermediate layer and establishing direct contact between LED chips and the light guide panel, the design eliminates the air-glass interfaces that cause partial light reflection, thereby maximizing light incidence efficiency
Solution Approach 2:
The patent uses the light guide panel substrate itself as the intermediary medium between LED chips and the optical system, rather than using a separate package substrate. This intermediary substrate is designed with optimized optical properties and direct coupling structures that minimize light reflection and maximize light transmission into the display panel
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The COB-type LED module enhances light incidence efficiency and reduces the outer thickness of the BLU by ensuring direct contact between the LED chips and the light guide panel, minimizing light loss and manufacturing costs.
Implementation Method 1
The insertion recess may include a transparent resin injected in the insertion recess to bond the LED chip
Data Source
AI summary
A backlight unit (BLU) is disclosed. The BLU may include a light emitting diode (LED) module including at least one LED chip mounted on a substrate in a chip-on-board (COB) type, and a light guide panel including an incidence surface configured to receive light emitted from an emission surface of the LED chip and to include at least one insertion recess disposed corresponding to the LED chip, such that the LED chip is bonded to the LED module to be inserted in the insertion recess.