Multi-COB-LED Module Wire Bonding for Light Pre-Mixing
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Solution Overview
Problem
Current COB-LED lighting modules struggle to enhance light pre-mixing capabilities without compromising the compactness of their light emitting surface.
Innovation Solution
A multi-COB-LED lighting module design featuring a submount with clusters of LED-chips arranged in a matrix configuration, where at least two LED-chips from one cluster are connected to others via wire bonds extending above adjacent chips, allowing for increased light pre-mixing while maintaining the compactness of the light emitting surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of LED-chips is increased to enhance light pre-mixing capabilities, then the light pre-mixing capability is improved, but the light emitting surface area increases
Solution Approach 1:
The patent utilizes the vertical dimension by extending wire bonds above the LED-chip cluster to connect to additional LED-chips positioned at different heights or layers. This three-dimensional arrangement allows more LED-chips to be integrated within a compact footprint, enhancing light pre-mixing capability without proportionally increasing the horizontal light emitting surface area.
Solution Approach 2:
The patent employs a nested structure where multiple LED-chips are arranged in clusters with some chips positioned above others. The wire bonds extend vertically to connect chips across different levels, creating a compact, space-efficient configuration that maximizes the number of light sources within a limited area while maintaining effective light pre-mixing.
2Adaptability or versatility
If wire bonds are extended above LED-chips to connect different clusters, then the light pre-mixing is enhanced, but the device complexity increases
Solution Approach 1:
The patent divides the LED-chip arrangement into distinct clusters that are connected through wire bonds. This segmentation allows for modular design where each cluster can be independently configured and connected, simplifying the overall wiring complexity by organizing connections into manageable groups rather than requiring complex individual connections for each chip.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module achieves enhanced light pre-mixing capabilities without compromising the compactness of the light emitting surface, offering improved color adjustment and luminous flux while maintaining a compact form factor.
Implementation Method 1
a plurality of clusters of LED-chips (4) arranged on the submount (2) according to a geometric matrix distribution and adapted, in use, to emit light radiation in respective emission bands
Implementation Method 2
connect one to the other by at least a wire bond (5) that extends above one or more of the adjoining LED-chips
Data Source
AI summary
A multi-COB-LED lighting module includes a submount; and a plurality of clusters of LED-chips that emit light radiation in respective emission bands, wherein each LED-chip cluster includes a plurality of LED-chips arranged on the submount by chip on board technology and emit light radiation in a respective emission band, and at least two LED-chips of at least a first LED-chip cluster each borders with a plurality of LED-chips belonging to one or more clusters of LED-chips different from the first LED-chip cluster and connect one to the other by at least a wire bond that extends above one or more of the adjoining LED-chips.