Cobalt Outer Layer Electromagnetic Shielding for RF Modules
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Solution Overview
Problem
Current radio frequency (RF) communication systems face challenges in providing effective electromagnetic shielding, particularly at lower frequency ranges, which can lead to interference from electromagnetic emissions, such as those from wireless charging circuits, and require innovative solutions to enhance performance and distinguish components visually.
Innovation Solution
A packaged radio frequency module with an electromagnetic shielding structure that includes an outer layer of cobalt, which provides wideband shielding from 100 kHz to 5 MHz, and is integrated into semiconductor dies and printed circuit boards, aiding in the identification of high-performance components through a distinctive blue color.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional electromagnetic shielding structures are used, then shielding effectiveness at high frequencies is achieved, but shielding effectiveness at lower frequencies (100 kHz to 5 MHz) is insufficient
Solution Approach 1:
The patent changes the material parameter of the shielding structure by incorporating cobalt into the outer layer, which fundamentally alters the electromagnetic properties of the shielding material to achieve effective shielding at lower frequency ranges (100 kHz to 5 MHz) where conventional materials fail
Solution Approach 2:
The patent uses a composite shielding structure with multiple layers including a copper base layer and a cobalt outer layer, combining the advantages of different materials to achieve both high-frequency and low-frequency shielding effectiveness, thereby resolving the limitation of single-material shielding structures
2Ease of manufacture
If standard shielding structures without distinctive coloring are used, then manufacturing simplicity is maintained, but component identification and visual distinction of high-performance features become difficult
Solution Approach 1:
The patent applies color change principle by utilizing the distinctive blue color of the cobalt outer layer to provide visual identification of high-performance RF components, allowing operators to easily distinguish shielded components from non-shielded ones without adding complex identification mechanisms
Solution Approach 2:
The cobalt outer layer serves multiple functions simultaneously: it provides electromagnetic shielding at lower frequencies and acts as a visual identifier through its distinctive blue color, thereby eliminating the need for separate identification features and simplifying the overall manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cobalt-based shielding structure effectively reduces electromagnetic interference, enabling RF communication devices to operate reliably in noisy environments, including during wireless charging, while the blue color facilitates easier identification and reduces operator errors in manufacturing and assembly.
Implementation Method 1
an electromagnetic shielding structure at least partially covers the molding compound, the electromagnetic shielding structure having an outer layer including cobalt
Implementation Method 2
The cobalt-based shielding structure effectively reduces electromagnetic interference
Data Source
AI summary
A method for providing electromagnetic shielding of a semiconductor die includes attaching a semiconductor die to a package substrate of a packaged radio frequency module, where the package substrate includes one or more radio frequency circuits fabricated therein. The method also includes encapsulating the semiconductor die with a molding compound. The method also includes at least partially covering the molding compound with an electromagnetic shielding structure having an outer layer including cobalt. A phone board assembly can include the packaged radio frequency module attached to a printed circuit board. The packaged radio frequency module can be incorporated into a mobile device.