COC COP Support Material for 3D Printing Polyimide

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Solution Overview

Problem

The challenge in 3D printing of polymer compounds is finding a support material that provides sufficient melt strength during construction while being easily removable at room temperature without adhesive issues or contamination, especially for polyetherimide and polyetherimide/polycarbonate blends, where suitable solvents are limited and processing is complex.

Innovation Solution

Cyclic olefin copolymer (COC) and cyclic olefin polymer (COP) are used as support materials due to their suitable viscosity, melt strength, thermal stability, and debonding properties, which allow them to support the build material during printing and easily separate after cooling, without relying on additives that could contaminate the final product.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If polymeric support materials are chosen based on solubility in solvents, then support material can be removed from build material, but finding suitable solvents is limited and processing of solvent after use is complex

Engineering Contradiction:

Improvesupport material removalVSAvoidsolvent processing

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent replaces the chemical removal mechanism (solvent dissolution) with a mechanical/physical separation mechanism (debonding due to poor adhesion and thermal expansion differences). The support material is designed to naturally separate from the build material through physical means rather than requiring chemical solvents, thereby eliminating solvent processing complexity.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the removal mechanism from chemical (solvent-based) to physical (thermal expansion and adhesion-based debonding). By selecting support materials with specific thermal expansion coefficients that differ from the build material, and ensuring poor adhesion between the two materials, the support material automatically debonds at room temperature without requiring solvent intervention.

Inventive Principle:

Principle #35Parameter changes

2Strength

If support material has high melt strength to support build material during construction, then scaffolding integrity is maintained, but support material may not easily break away at room temperature

Engineering Contradiction:

Improvemelt strength of support materialVSAvoiddebonding at room temperature

Core Design Contradiction:

StrengthVSEase of operation

Solution Approach 1:

The patent exploits parameter changes with temperature. At processing temperature, the support material has high melt strength to maintain scaffolding integrity. At room temperature, the combination of poor adhesion and differential thermal expansion causes automatic debonding. This temperature-dependent behavior resolves the contradiction between needing strength during construction and ease of removal afterward.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent utilizes thermal expansion differences between the support material and build material. As the system cools from processing temperature to room temperature, the differential contraction creates stresses that promote debonding at the interface, facilitating easy separation after construction without compromising the support material's strength during the printing process.

Inventive Principle:

Principle #37Thermal expansion

3Ease of manufacture

If support material has viscosity similar to build material for proper rheological properties, then support material can be deposited, but may not provide sufficient melt strength to prevent flowing away

Engineering Contradiction:

Improvedeposition of support materialVSAvoidmelt strength to prevent flow

Core Design Contradiction:

Ease of manufactureVSStrength

Solution Approach 1:

The patent applies local quality by having the support material exhibit different rheological properties at different stages: during deposition, it has viscosity similar to the build material for compatibility; during scaffolding formation, it develops sufficient melt strength to maintain structure; and during removal, it debonds easily. This spatial and temporal variation in material properties resolves the contradiction.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

COC and COP effectively support the build material during 3D printing and facilitate easy debonding at room temperature, ensuring the integrity and purity of the final polymer article, with the added benefit of being impact-modifiable and distinguishable for easy removal.

Implementation Method 1

Both COC and COP (a) have sufficient melt strength at the processing temperature range of polyetherimide (PEI) and polyetherimide/polycarbonate blends (PEI/PC) to build a good scaffold

Methodology Applied

Scientific EffectMelt strength:

Implementation Method 2

have a viscosity vs. shear rate similar to the build material and also sufficient melt strength so that it supports the build material

Methodology Applied

Scientific EffectViscosity:

Implementation Method 3

breaks away at room temperature from the build material because of lack of adhesion of the support material to the build material and/or because of differences in coefficient of thermal expansion (CTE) properties between the build material and the support material

Methodology Applied

Scientific EffectCoefficient of thermal expansion (CTE): Thermal Expansion

Data Source

PatentUS11001049B2Support material for 3D printing of polymer compounds

Publication Date: 2021.05.11 AVIENT CORP

AI summary

Cyclic olefin copolymer (COC) and cyclic olefin polymer (COP) are useful as support material for 3D printing of high temperature polymers, such as polyimides.