Coded Heat Dissipation Substrates for Power Module Thickness Control
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Solution Overview
Problem
The existing heat dissipation substrates for power semiconductors face challenges in meeting strict thickness specifications due to variable ceramic substrate and metal plate thicknesses, and there is a lack of accurate management of production and quality information for individual substrates.
Innovation Solution
A method of manufacturing heat dissipation substrates that involves marking a unique code on a ceramic substrate, storing this information on a central server, and using it to accurately match and update production and quality information throughout the manufacturing process, ensuring precise thickness control and quality management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If variable thickness ceramic substrates and metal plates are used, then manufacturing flexibility and adaptability are improved, but manufacturing precision and thickness control deteriorate
Solution Approach 1:
The patent applies preliminary action by measuring and marking the thickness of each ceramic substrate and metal plate before the stacking process. This allows the system to pre-calculate the total thickness and identify appropriate combinations that meet specifications, rather than discovering thickness issues during final inspection. The marking step creates a permanent record that guides subsequent assembly decisions.
Solution Approach 2:
The patent implements feedback through a centralized server that stores thickness information and provides real-time guidance on compatible stacking combinations. When substrates or plates are measured, their data is uploaded to the server, which then recommends specific pairings. This closed-loop system continuously monitors and adjusts stacking decisions based on accumulated data, ensuring thickness specifications are met while maintaining flexibility in material selection.
2Measurement precision
If individual tracking and data management for each substrate is implemented, then quality management and information accuracy are improved, but device complexity and system complexity increase
Solution Approach 1:
The patent applies universality by using a single centralized server to perform multiple functions: storing thickness data, tracking unique codes, managing quality information, and providing stacking recommendations. This multi-functional system replaces what would otherwise require separate specialized systems for each function, reducing overall complexity while maintaining comprehensive tracking and management capabilities for every substrate and component.
3Manufacturing precision
If strict thickness specifications are enforced, then manufacturing precision and product quality are improved, but productivity and ease of manufacture deteriorate
Solution Approach 1:
The patent resolves this contradiction by performing thickness measurement and compatibility assessment before stacking operations begin. By pre-identifying suitable combinations through the centralized server's database and algorithms, the system avoids time-consuming trial-and-error assembly and rework. This preliminary sorting and matching process ensures that when stacking does occur, components are already verified to meet specifications, maintaining both precision and productivity.
Solution Approach 2:
The system maintains productivity despite strict specifications by providing real-time feedback guidance to operators through the centralized server. Rather than requiring manual measurement and calculation during assembly, the server automatically recommends pre-validated combinations, allowing operators to efficiently assemble components that are guaranteed to meet thickness requirements. This automated decision support eliminates bottlenecks while enforcing precision.
Data Source
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AI summary
The embodiment relates to a power converter including a power semiconductor module and a power semiconductor module equipped with a unique code, and a method of manufacturing the same comprising a ceramic substrate for a heat dissipation substrate with a unique code, a heat dissipation substrate for a power semiconductor module with a unique code, a power semiconductor module including a heat dissipation substrate with a unique code. A method of manufacturing a heat dissipation substrate for a power semiconductor according to an embodiment includes a loading step of a ceramic substrate including an active area (AA) of the ceramic substrate and a dummy area (DA) of the ceramic substrate disposed outside the active area (AA) and a marking step of a unique code (UC) on the dummy area (DA) of the ceramic substrate. Additionally, the embodiment may further include the cleaning step of the ceramic substrate and the measuring step of a thickness of the cleaned ceramic substrate. The unique code is stored in a predetermined central server, and the unique code may include thickness information of the ceramic substrate.