COF Bonding Detection Layout With Fewer Test Pins
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Solution Overview
Problem
Existing display device bonding detection methods require multiple test pin pairs to assess bonding states between display panels, chip on flex, and flexible circuit boards, which increases the bonding region width and occupies precious space on the flexible circuit board.
Innovation Solution
A display device configuration with a first detection line on the display panel, and second and third detection lines extending to the flexible circuit board through the chip on flex, utilizing two pairs of test pins to determine the bonding states by measuring resistance across different paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple test pin pairs are used to detect bonding states, then detection reliability is improved, but the bonding region width increases and occupies space on the flexible circuit board
Solution Approach 1:
The patent combines multiple detection functions into a unified test pin configuration. Two test pin pairs (first and second test pin pairs) are strategically positioned to simultaneously detect bonding states between the display panel and chip on flex, and between the chip on flex and flexible circuit board, merging what would traditionally require separate detection systems into a compact integrated arrangement that reduces overall space occupation.
Solution Approach 2:
The test pin pairs serve multiple detection purposes. The first test pin pair detects bonding between the display panel and chip on flex, while the second test pin pair detects bonding between the chip on flex and flexible circuit board. This multi-functional design allows a single test pin configuration to perform what would traditionally require multiple separate detection systems, thereby reducing the bonding region width and flexible circuit board area.
2Measurement precision
If more test pins are placed on the flexible circuit board, then bonding detection precision is improved, but device complexity increases
Solution Approach 1:
The detection system is segmented into two distinct test pin pairs with specific functions. The first test pin pair is dedicated to detecting bonding between the display panel and chip on flex, while the second test pin pair detects bonding between the chip on flex and flexible circuit board. This segmentation allows each test pin pair to be optimized for its specific detection task, improving measurement precision while maintaining manageable device complexity through functional specialization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for effective detection of bonding states between the display panel and chip on flex, and between the chip on flex and flexible circuit board, using only two pairs of test pins, thereby reducing the number of test pins required and facilitating frame narrowing of the display device.
Implementation Method 1
determining a bonding state of a display panel and a chip on flex, a bonding state of the chip on flex and a flexible circuit board and a state of the display panel according to resistance between two first test pins on a path where a second detection line is located, resistance between two second test pins on a path where a third detection line is located, and resistance between any one of the first test pins on the path where the second detection line is located and any one of the second test pins on the path where the third detection line is located
Data Source
AI summary
A display device and a bonding detection method of the display device are provided. The display device includes: a display panel, a flexible circuit board and a chip on flex with a control chip, where the display panel is connected with the flexible circuit board through the chip on flex in a bonding manner, a first detection line located on the display panel, a second detection line extending to the flexible circuit board from one end of the first detection line through the chip on flex, and a third detection line extending to the flexible circuit board from the other end of the first detection line through the chip on flex, where a path where the second detection line is located is provided with at least two first test pins, and a path where the third detection line is located is provided with at least two second test pins.