COF Bridge Film Layout for Bezel-Less Display Dead Space Reduction
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Solution Overview
Problem
In recent display apparatuses with small bezels and thin panels, the area where the COF package and the display panel contact each other is reduced, leading to increased dead space, which is challenging to minimize without compromising the bezel-less design.
Innovation Solution
The proposed solution involves a COF package design that includes a base film with a display driver IC mounted on it and a heat dissipation member on the lower surface. A bridge film with an overlapping edge and conductive lines is used to connect multiple base films to the display panel, effectively reducing dead space by acting as a fan-out area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the contact area between COF package and display panel is reduced to achieve thin panel design, then the panel thickness is reduced, but the dead space increases
Solution Approach 1:
The bridge film extends the COF package structure in the planar dimension beyond the base film edges, allowing electrical connections to reach the display panel edge without increasing the vertical profile. This dimensional extension enables the COF package to serve as a fan-out area that reduces dead space while maintaining thin panel design.
2Area of stationary object
If the bezel size is reduced to achieve bezel-less design, then the aesthetic appearance is improved, but the area for mounting COF package is reduced
Solution Approach 1:
The bridge film performs multiple functions: it serves as an electrical connection medium, extends the fan-out area for signal routing, and acts as a structural support element. This multi-functionality allows the COF package to be mounted with reduced bezel area while maintaining manufacturing feasibility through integrated design.
3Area of stationary object
If the bridge film length is increased to reduce dead space, then the dead space is minimized, but the device complexity increases
Solution Approach 1:
The bridge film is integrated with the base film to form a unified COF package structure, eliminating the need for separate mounting components. This merging of elements reduces device complexity while achieving dead space minimization through the extended bridge film structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design efficiently minimizes the dead space on the display panel, enabling a bezel-less display apparatus by utilizing the bridge film to couple the COF package to the display panel, thus enhancing the overall display apparatus design.
Implementation Method 1
a heat dissipation member arranged in correspondence with the display driver IC on the lower surface of the base film
Implementation Method 2
The upper surface of the base film and the lower surface of the bridge film adhere to each other in their respective long axis directions
Data Source
AI summary
A chip on film (COF) package includes a base film having an upper surface and a lower surface opposite to each other, a bridge film having an edge that overlaps the base film, and an upper surface and a lower surface opposite to each other, a display driver integrated circuit (IC) mounted on the upper surface of the base film, and a heat dissipation member arranged in correspondence with the display driver IC on the lower surface of the base film. The upper surface of the base film and the lower surface of the bridge film adhere to each other in their respective long axis directions, and a long axis length of the bridge film is greater than a long axis length of the base film.