Flexible Substrate Heat Dissipation Module for COF Chip Thermal Management
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Solution Overview
Problem
As display devices become lighter and thinner, especially with the use of COF (Chip on film) packages, there is a need for effective heat dissipation solutions that can efficiently manage heat generated by chips on flexible substrates without causing mechanical stress or damage to these substrates.
Innovation Solution
A heat dissipation module comprising a thermal-conductive supporting component and heat dissipation structures that are thermally connected to both the supporting component and the flexible substrate, allowing the substrate to be deformed and enhancing thermal contact while being cost-effective and easy to assemble.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation structures are applied to flexible substrates, then heat dissipation effectiveness is improved, but the flexible substrate may be damaged or deformed due to mechanical stress
Solution Approach 1:
The patent changes the physical state of the heat dissipation structure from rigid to soft/compressible, allowing it to deform elastically and apply uniform pressure without damaging the flexible substrate. The soft material properties enable effective thermal contact while preserving substrate integrity.
Solution Approach 2:
The heat dissipation structure uses composite materials combining soft compressible material with thermally conductive fillers (metal particles, ceramic particles, or carbon particles). This composite approach provides both the mechanical compliance needed to protect the substrate and the thermal conductivity needed for effective heat dissipation.
2Temperature
If rigid heat dissipation structures are used, then thermal contact is improved, but assembly complexity increases and the substrate may be damaged
Solution Approach 1:
The soft heat dissipation structure automatically conforms to the flexible substrate's surface topology upon contact, eliminating the need for precise alignment or complex mounting mechanisms. The material's compliance allows it to self-adjust and maintain optimal thermal contact without additional assembly steps.
Solution Approach 2:
By changing from rigid to soft material, the heat dissipation structure gains the ability to adapt its shape and conform to the substrate, achieving effective thermal contact through material compliance rather than mechanical precision, thereby simplifying assembly.
3Temperature
If the flexible substrate is deformed to enhance thermal contact, then heat dissipation is improved, but the substrate may be damaged
Solution Approach 1:
The patent uses soft compressible materials with elastic properties that allow reversible deformation. The material can be compressed to enhance thermal contact during assembly but returns to its original state, preventing permanent damage to the flexible substrate while maintaining reliable thermal coupling.
Solution Approach 2:
The soft heat dissipation structure acts as a cushioning element that absorbs mechanical stress during assembly and operation. It protects the flexible substrate from excessive deformation forces by providing a compliant interface that distributes pressure uniformly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively absorbs heat from the flexible substrate, maintaining chip temperatures below the operational limit and preventing thermal deformation, while being cost-effective and reliable, with the heat dissipation structures being self-adhesive and capable of withstanding vibration tests.
Implementation Method 1
at least one heat dissipation structure... in thermal contact with the flexible substrate so as to force the flexible substrate to be deformed
Implementation Method 2
one side of the at least one heat dissipation structure is in thermal contact with the thermal-conductive supporting component
Implementation Method 3
another side of the at least one heat dissipation structure is configured to be in thermal contact with the flexible substrate so as to force the flexible substrate to be deformed
Data Source
AI summary
The disclosure relates to a heat dissipation module, a display device having the same, and an assembly method thereof. Place the heat dissipation structure in between the chip of the COF (chip-on-film) and the thermal-conductive supporting component, heat generated by the chip of the COF can be absorbed by the heat dissipation structure and then be transferred to the thermal-conductive supporting component through the heat dissipation structure. As a result, the temperature of the chip is decreased, and the chip is avoided from operating at high temperature to deteriorate its performance and to result in thermal deformation or any other negative effects on the nearby components.