Chip-on-Film Display Bezel Narrowing via Substrate Through-Holes
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Solution Overview
Problem
Existing display devices face challenges in narrowing the bezel portion, particularly for wearable devices with non-rectangular shapes, which affects aesthetics and requires complex manufacturing processes and higher costs.
Innovation Solution
A display apparatus using a chip-on-film (COF) configuration with a plastic substrate, through-holes, and pad parts to reduce the bezel width, involving a method of forming through-holes in pads, inserting conductors, and connecting chip-on-film pads to simplify processes and lower manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If traditional display panel structures are used, then manufacturing processes are simpler, but the bezel portion cannot be narrowed
Solution Approach 1:
The patent moves the connection between the substrate and COF from the front surface to the back surface of the substrate through through-holes. This dimensional change allows the bezel to be narrowed on the front surface while maintaining all necessary electrical connections, resolving the contradiction between narrow bezel and manufacturing complexity
Solution Approach 2:
The conductor is inserted into the through-hole of the substrate, creating a nested structure where the conductor is contained within the substrate thickness. This allows electrical connections to be made without occupying front surface area, enabling bezel narrowing while maintaining connection functionality
2Length of moving object
If through-holes and conductors are added to narrow the bezel, then the bezel portion is narrowed, but manufacturing complexity increases
Solution Approach 1:
The substrate's own thickness is utilized to create the connection path through the through-hole, eliminating the need for separate bending structures or additional processing steps. The substrate serves both as the display carrier and as the medium for electrical connection, simplifying the overall manufacturing process despite adding through-holes
3Reliability
If the substrate is bent to connect COF, then connections are achieved, but the substrate integrity is compromised
Solution Approach 1:
The through-holes are formed and conductors are inserted into the substrate before the COF is mounted. This preliminary preparation of connection paths eliminates the need for subsequent bending or deformation of the substrate, maintaining substrate integrity while ensuring reliable electrical connections
Data Source
AI summary
The present aspects provide a display apparatus including a chip-on-film (COF), which may include: a plastic substrate configured to have at least one through-hole formed in one area thereof and a conductor inserted into the through-hole; a display part configured to be disposed in another area on an upper surface of the plastic substrate; a first pad part configured to have a plurality of pads, at least one of which is disposed in the one area on the upper surface of the plastic substrate to overlap the through-hole, and configured to be connected to one end of the conductor; and a second pad part configured to be disposed on a back surface of the plastic substrate, and configured to have a plurality of pads, at least one of which is in contact with the other end of the conductor, and further provide a method for manufacturing the same.