Chip On Film Display Panel Narrow Bezel Manufacturing
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Solution Overview
Problem
The manufacturing of display products with narrow bezels using pad bending processes results in low yield due to cracking of inorganic insulation layers, necessitating additional mask processes that increase complexity and cost.
Innovation Solution
A display panel design featuring a Chip On Film (COF) with an integrated circuit chip and insulation adhesive on the frame edge of the display substrate, along with connection holes filled with electrically conductive material to connect signal lines with connection terminals, eliminating the need for pad bending and bonding processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If pad bending process is used to manufacture narrow bezel display products, then the bezel width can be reduced, but the inorganic insulation layer cracks and yield decreases
Solution Approach 1:
The patent removes the inorganic insulation layer from the pad bending area through a mask process, extracting the problematic component that causes cracking during bending. This allows the pad to be bent without the insulation layer interfering and causing defects, thereby maintaining high yield while achieving narrow bezel width.
Solution Approach 2:
The inorganic insulation layer is removed in advance before the pad bending process. By performing this removal action preliminarily, the subsequent bending operation can proceed without causing cracks to the insulation layer, thus preventing yield loss while enabling narrow bezel design.
2Reliability
If additional mask processes are used to remove inorganic insulation layer and form organic insulation layer, then cracking is avoided, but process complexity and manufacturing cost increase
Solution Approach 1:
The patent combines the removal of inorganic insulation layer and the formation of organic insulation layer into a single integrated mask process. Instead of performing these as separate additional processes, they are merged into one step, reducing process complexity and manufacturing cost while still preventing cracking in the pad bending area.
3Reliability
If additional mask processes are used to protect inorganic insulation layer, then display failure is avoided, but manufacturing efficiency decreases
Solution Approach 1:
The inorganic insulation layer is extracted (removed) from the pad bending area where it would be vulnerable to cracking. By removing it preliminarily, the need for multiple protective mask processes during bending is eliminated, thereby improving manufacturing efficiency while still avoiding display failures through the subsequent formation of organic insulation layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing complexity, improves yield, and narrows the bezel width to below 2 mm by avoiding pad bending and bonding-related issues, while maintaining effective electrical connections.
Implementation Method 1
an electrically conductive material filled in the respective connection holes, on the frame edge; and signal lines located on a frame edge of the display face of the display substrate are connected with connection terminals arranged on the side of the chip on film away from the display substrate through the electrically conductive material
Implementation Method 2
an insulation adhesive filled between the display substrate and the chip on film, and an integrated circuit chip fixed on a side of the chip on film away from the display substrate, wherein: the chip on film is fixed on the frame edge of the side of the display substrate away from the display face through the insulation adhesive
Data Source
AI summary
The disclosure discloses a display panel, a display device, and a method for manufacturing the display panel, where a chip on film is adhered on a frame edge of a side of a display substrate away from a display face of the display substrate through an insulation adhesive, and then signal lines on a frame edge of the display face of the display substrate are connected with connection terminals arranged on a side of the chip on film away from the display substrate through an electrically conductive material in a plurality of connection holes running through the display substrate, the insulation adhesive and the chip on film, so a pad bending process can be dispensed with, and there will be no pad bending area on the frame edge of the display panel, thus further narrowing a bezel of the display panel.