Chip-on-Film Package Heat Emission Structure for Thin Displays
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Solution Overview
Problem
As display panels with reduced bezel size and thickness face challenges in efficiently dissipating heat, there is a growing need for effective heat management techniques in chip-on-film (COF) packages to prevent thermal issues.
Innovation Solution
The implementation of a COF package design that includes a heat emission layer and an insulating layer, along with a protective layer, to enhance heat radiation and insulation features, utilizing a composite material tape with a heat emission layer and insulating layer to effectively manage heat emitted from semiconductor chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If display panel thickness and bezel size are reduced, then device compactness is improved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The heat management system is segmented into multiple functional layers: heat emission layer (first functional layer), insulating layer (second functional layer), and protective layer (third functional layer). This segmentation allows each layer to perform its specific function optimally - the heat emission layer dissipates heat laterally, the insulating layer prevents heat transfer to the back surface, and the protective layer provides mechanical protection while maintaining thermal performance.
Solution Approach 2:
The patent employs composite material structure with distinct thermal properties for each layer. The heat emission layer uses materials with high in-plane thermal conductivity for lateral heat dissipation, while the insulating layer uses materials with low thermal conductivity to block heat transfer in the thickness direction. This composite approach resolves the contradiction by creating a anisotropic thermal management system tailored to the compact form factor constraints.
2Temperature
If heat emission layer is added to improve heat dissipation, then thermal management is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple functions into the heat emission layer structure itself. The heat emission layer simultaneously serves as a thermal management component, a structural element of the COF package, and a platform for mounting additional functional layers. This merging approach improves heat dissipation while minimizing the increase in overall device complexity by integrating rather than adding separate systems.
Solution Approach 2:
The heat emission layer is designed with multi-functionality: it provides lateral heat dissipation, serves as a mounting substrate for the insulating and protective layers, and can be integrated with existing COF package processes. This multi-functionality reduces the need for separate dedicated heat management components, thereby improving thermal performance without proportionally increasing device complexity.
3Temperature
If insulating layer is disposed on heat emission layer to prevent heat transfer, then heat insulation is improved, but manufacturing complexity increases
Solution Approach 1:
The insulating layer is preliminarily formed with adhesive layers on its surfaces before being mounted on the heat emission layer. This preliminary preparation of adhesive interfaces simplifies the assembly process, as the adhesive is already in position and does not require complex application steps during final assembly. The preliminary action reduces manufacturing complexity by pre-configuring the components for easy integration.
Solution Approach 2:
Adhesive layers serve as intermediaries between the heat emission layer and insulating layer, and between the insulating layer and protective layer. These intermediary adhesive layers simplify the bonding process by providing a dedicated interface material that facilitates attachment while accommodating thermal expansion differences and surface irregularities, thereby reducing manufacturing complexity compared to direct bonding approaches.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat radiation and insulation, reducing thermal fatigue and increasing thermal resistance, thereby enhancing the reliability of the display apparatus by effectively managing heat dissipation in compact display devices.
Implementation Method 1
a heat emission layer disposed on the lower surface of the base film to at least partially overlap the semiconductor chip in a thickness direction
Implementation Method 2
heat emission layer... to enhance heat radiation
Implementation Method 3
an insulating layer disposed on a lower surface of the heat emission layer
Data Source
AI summary
A chip-on-film package includes a base film including an upper surface and a lower surface that opposite from each other, a semiconductor chip mounted on the upper surface of the base film, a heat emission layer disposed on the lower surface of the base film to at least partially overlap the semiconductor chip in a thickness direction, an insulating layer disposed on a lower surface of the heat emission layer, and a protective layer surrounding side and lower surfaces of the insulating layer. Accordingly, thermal fatigue of the chip-on-film package may be reduced, and reliability may be increased.