COF Semiconductor Package Heat Dissipation via Conductive Underfill
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Solution Overview
Problem
The challenge in the field of liquid crystal display devices is the effective dissipation of heat generated by integrated circuits, which affects the stability of the circuits and the heat-resistant temperature of flexible base films, particularly in high-resolution displays like UHD TVs, where current solutions fail to adequately address heat dissipation and protection from external impacts.
Innovation Solution
A chip on film (COF) type semiconductor package is developed, featuring a flexible film with an electrode pattern, a semiconductor device, a conductive pad for electrical connection, and a first protective layer made of heat conductive material to dissipate heat and protect the device from external impacts, using a method that includes coating with heat dissipation paint and curing processes to form an underfill and upperfill for efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If integrated circuits are highly integrated to reduce cost and achieve high resolution, then display device functionality is improved, but heat generation increases affecting circuit stability and flexible base film temperature resistance
Solution Approach 1:
The patent extracts the heat dissipation function from the traditional package structure by introducing a dedicated heat dissipation paint layer that is applied specifically to the semiconductor device. This separate heat dissipation pathway allows the display resolution to be improved through high integration while the heat is actively managed through the extracted heat dissipation mechanism, preventing temperature buildup that would affect circuit stability and flexible base film integrity
Solution Approach 2:
The patent employs composite materials by combining the semiconductor device with a specially formulated heat dissipation paint that contains heat conductive fillers suspended in a resin matrix. This composite structure enables efficient heat transfer from the high-resolution integrated circuits while maintaining the flexibility of the base film, thus resolving the contradiction between high integration (improved resolution) and heat management (temperature control)
2Reliability
If a protective layer is added to protect semiconductor device from external impacts, then reliability is improved, but device complexity and manufacturing steps increase
Solution Approach 1:
The patent applies the multi-functionality principle by designing a heat dissipation paint that simultaneously provides three functions: (1) heat dissipation through conductive fillers, (2) mechanical protection against external impacts by filling and sealing the semiconductor device, and (3) electrical insulation. This universal protective layer eliminates the need for separate protective structures, thereby improving reliability without significantly increasing device complexity or manufacturing steps
Solution Approach 2:
The patent merges the heat dissipation function and the protection function into a single integrated solution. The heat dissipation paint is applied to both dissipate heat from the semiconductor device and provide mechanical protection by filling voids and sealing the device structure. This merging of functions reduces the number of separate components and layers needed, maintaining simplicity while achieving both thermal management and impact protection
3Temperature
If heat dissipation paint is applied to semiconductor device, then heat dissipation is improved, but manufacturing process complexity increases
Solution Approach 1:
The patent applies parameter changes by carefully controlling the viscosity, curing characteristics, and thermal conductivity parameters of the heat dissipation paint to enable simple application methods. The paint is formulated with specific rheological properties that allow it to be applied using straightforward techniques such as screen printing or dispensing, and its curing characteristics are optimized to match standard reflow soldering profiles. This ensures improved heat dissipation efficiency while maintaining ease of manufacture by avoiding complex additional manufacturing steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively dissipates high heat from semiconductor devices, allowing for a slimmer design in ultra-high resolution displays, enabling the use of plastic materials for bezel and chassis parts, reducing weight and production costs while protecting the semiconductor package from external impacts.
Implementation Method 1
a first protective layer which seals the conductive pad and the semiconductor device and is formed on a portion of the electrode pattern and the semiconductor device. The first protective layer may include a heat conductive material for dissipating heat generated from the semiconductor device
Data Source
AI summary
Provided is a chip on film (COF) type semiconductor package. The COF type semiconductor device includes a flexible film, an electrode pattern formed on the flexible film, a semiconductor device disposed on the electrode pattern, a conductive pad disposed between the electrode pattern and the semiconductor device to electrically connect the semiconductor device with the electrode pattern, and a first protective layer which seals the conductive pad and the semiconductor device and is formed on a portion of the electrode pattern and the semiconductor device. The first protective layer includes a heat conductive material for dissipating heat generated from the semiconductor device.